Upright Chip Package Body Layout for Higher Space Utilization

The patent transitions from traditional planar packaging to three-dimensional packaging by mounting chips upright in depth-controlled grooves. This vertical arrangement utilizes the Z-dimension (height) of the package body, dramatically increasing space utilization. The connecting members extend vertically to connect chip side surfaces to pads, enabling efficient use of vertical space while maintaining electrical connectivity.

The patent implements nested packaging by placing multiple components within the package body in a hierarchical arrangement. The depth-controlled grooves nest the chips upright, while connecting members nest within the plastic packaging layers. This nested structure allows multiple components to occupy overlapping spatial volumes, maximizing space utilization without increasing the package footprint.

The depth-controlled grooves are prepared in advance during the packaging process, before chip mounting. This preliminary action establishes precise depth references that guide subsequent chip placement. The connecting members are also prepared beforehand with predetermined lengths and positions, ensuring that when chips are mounted upright, they align correctly with the grooves and connecting members, reducing the precision burden on the final mounting step.

The patent replaces traditional mechanical alignment methods with depth-controlled geometric features. The grooves provide mechanical stops and alignment references that passively ensure correct chip positioning and orientation. This geometric constraint system substitutes for complex active alignment mechanisms, achieving high precision through clever mechanical design rather than sophisticated control systems.

The connecting members serve multiple functions simultaneously: they provide electrical connectivity between chip side surfaces and pads, act as mechanical support structures for upright chip mounting, and serve as alignment references during assembly. The depth-controlled grooves similarly perform multiple roles: defining chip placement position, controlling chip orientation, and providing mechanical retention. This multi-functionality reduces the need for separate dedicated components for each function.

The patent merges the functions of mechanical support and electrical connection into the connecting members. Rather than using separate support structures and connection elements, the connecting members integrate both roles. Similarly, the depth-controlled grooves combine mechanical retention and alignment functions. This merging reduces component count while maintaining reliability of electrical connectivity and mechanical stability.