Upright Drive Board Layout for Stable Line Head Ejection
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Solution Overview
Problem
In line head printing for high-speed printing, the increase in nozzle density for high-definition imaging leads to increased inductance due to long wiring distances from the drive circuit, affecting ejection stability and necessitating more efficient use of space for drive circuits.
Innovation Solution
A drive unit is positioned opposite the ejecting orifice with a first board connected to a head connector and a second board mounted upright, supplying drive signals via the first board, optimizing the layout to reduce inductance effects and enhance ejection stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the drive circuit is disposed just above the head to reduce wiring distance, then ejection stability is improved, but the apparatus size increases and space efficiency decreases
Solution Approach 1:
The drive circuit board is positioned in an upright position relative to the head, changing the spatial arrangement from a planar layout to a three-dimensional configuration. This dimensional change allows the drive circuit to be located at a distance from the head while maintaining short wiring paths through vertical coupling, thus improving space efficiency without compromising ejection stability.
Solution Approach 2:
The system is divided into separate functional modules: the head unit and the drive circuit board, which are independently positioned and coupled. This segmentation allows each component to be optimized separately and connected through a standardized interface, enabling flexible spatial arrangement that reduces overall apparatus size while maintaining performance.
2Manufacturing precision
If nozzle density is increased for high-definition imaging, then image definition is improved, but inductance due to long wiring increases, affecting ejection stability
Solution Approach 1:
By positioning the drive circuit board upright relative to the head, the wiring path is shortened vertically despite the increased horizontal distance required for high nozzle density. This dimensional reconfiguration reduces inductance effects while maintaining the high nozzle density needed for high-definition imaging.
3Volume of moving object
If the drive circuit is positioned far from the head, then space efficiency is improved, but inductance due to long wiring increases, decreasing ejection stability
Solution Approach 1:
The upright positioning of the drive circuit board creates a vertical wiring path that is shorter than a horizontal path would be, even when the drive circuit is positioned at a distance from the head. This allows space efficiency to be improved without significantly increasing wiring length and inductance, thereby maintaining ejection stability.
Data Source
AI summary
A drive unit is located on an opposite side in relation to an ejecting orifice of a liquid ejecting head unit. The drive unit includes a first board including a first connector coupled to a head connector of the liquid ejecting head unit; and a second board on which a drive circuit configured to generate a drive signal is mounted. The second board is disposed in an upright position with respect to the first board by being B-to-B coupled to the first board, and the drive signal is supplied from the second board to the first connector via the first board.


