Upright Drive Board Layout for Stable Line Head Ejection

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Solution Overview

Problem

In line head printing for high-speed printing, the increase in nozzle density for high-definition imaging leads to increased inductance due to long wiring distances from the drive circuit, affecting ejection stability and necessitating more efficient use of space for drive circuits.

Innovation Solution

A drive unit is positioned opposite the ejecting orifice with a first board connected to a head connector and a second board mounted upright, supplying drive signals via the first board, optimizing the layout to reduce inductance effects and enhance ejection stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the drive circuit is disposed just above the head to reduce wiring distance, then ejection stability is improved, but the apparatus size increases and space efficiency decreases

Engineering Contradiction:
Improveejection stabilityVSAvoidapparatus size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The drive circuit board is positioned in an upright position relative to the head, changing the spatial arrangement from a planar layout to a three-dimensional configuration. This dimensional change allows the drive circuit to be located at a distance from the head while maintaining short wiring paths through vertical coupling, thus improving space efficiency without compromising ejection stability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The system is divided into separate functional modules: the head unit and the drive circuit board, which are independently positioned and coupled. This segmentation allows each component to be optimized separately and connected through a standardized interface, enabling flexible spatial arrangement that reduces overall apparatus size while maintaining performance.

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If nozzle density is increased for high-definition imaging, then image definition is improved, but inductance due to long wiring increases, affecting ejection stability

Engineering Contradiction:
Improveimage definitionVSAvoidejection stability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

By positioning the drive circuit board upright relative to the head, the wiring path is shortened vertically despite the increased horizontal distance required for high nozzle density. This dimensional reconfiguration reduces inductance effects while maintaining the high nozzle density needed for high-definition imaging.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Volume of moving object

If the drive circuit is positioned far from the head, then space efficiency is improved, but inductance due to long wiring increases, decreasing ejection stability

Engineering Contradiction:
Improveapparatus sizeVSAvoidejection stability
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The upright positioning of the drive circuit board creates a vertical wiring path that is shorter than a horizontal path would be, even when the drive circuit is positioned at a distance from the head. This allows space efficiency to be improved without significantly increasing wiring length and inductance, thereby maintaining ejection stability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12583219B2Drive unit, liquid ejecting head unit, and liquid ejecting apparatus
Publication Date: 2026.03.24 SEIKO EPSON CORP
  • US12583219B2 patent drawing
  • US12583219B2 patent drawing
  • US12583219B2 patent drawing

AI summary

A drive unit is located on an opposite side in relation to an ejecting orifice of a liquid ejecting head unit. The drive unit includes a first board including a first connector coupled to a head connector of the liquid ejecting head unit; and a second board on which a drive circuit configured to generate a drive signal is mounted. The second board is disposed in an upright position with respect to the first board by being B-to-B coupled to the first board, and the drive signal is supplied from the second board to the first connector via the first board.