UPS Liquid Cooling Baseplate for Space-Saving Heat Management

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Solution Overview

Problem

Conventional UPS configurations in data centers require significant resources and space for heat management, often necessitating dedicated air cooling equipment and raised floors/ceiling structures, which can be cumbersome and inefficient.

Innovation Solution

A liquid cooling system for UPS components, featuring a base member with fluid conduit structures and interconnecting channels to distribute cooling liquid, combined with air cooling via pumping modules and air-to-liquid heat exchangers mounted on the UPS doors, reducing the need for extensive air cooling systems and optimizing space usage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If dedicated air cooling equipment and raised floors/ceiling structures are provided for heat management, then cooling effectiveness is improved, but space occupation and device complexity increase

Engineering Contradiction:
Improvecooling effectivenessVSAvoidspace occupation
Core Design Contradiction:
TemperatureVSArea of stationary object

Solution Approach 1:

The patent extracts the cooling function from the UPS unit itself by providing dedicated air cooling equipment (air handling units) positioned between UPS units. This allows the cooling function to be separated from the power supply units, enabling more efficient heat management without increasing the footprint of individual UPS units.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent combines multiple cooling functions into a shared air handling unit positioned between UPS units. This single unit serves multiple UPS units simultaneously, reducing the total space required for cooling equipment compared to providing separate cooling systems for each UPS unit.

Inventive Principle:
Principle #5Merging (Combining)

2Temperature

If dedicated air cooling equipment and raised floors/ceiling structures are provided for heat management, then cooling effectiveness is improved, but device complexity increases

Engineering Contradiction:
Improvecooling effectivenessVSAvoidsystem complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The air handling units are designed to serve multiple UPS units simultaneously, performing a universal cooling function across the system. This multi-functionality reduces the overall number of cooling devices required and simplifies the system architecture compared to individual cooling systems for each UPS unit.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent segments the cooling system into modular air handling units that can be positioned between UPS units in a rack configuration. This segmentation allows for scalable deployment and simplified maintenance while maintaining effective cooling across the entire system.

Inventive Principle:
Principle #1Segmentation

3Power

If more cooling equipment is provided, then heat dissipation capacity is improved, but space requirements increase

Engineering Contradiction:
Improveheat dissipation capacityVSAvoidspace requirements
Core Design Contradiction:
PowerVSArea of stationary object

Solution Approach 1:

The patent merges cooling resources by positioning air handling units between UPS units, allowing a single cooling device to serve multiple power supply units. This approach increases heat dissipation capacity without proportionally increasing space requirements, as the cooling function is shared across multiple units.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The liquid cooling system efficiently dissipates a significant portion of UPS heat, allowing for compact design and reduced space requirements, facilitating easier maintenance and potentially increasing electrical power capacity while maintaining safe operating conditions.

Implementation Method 1

a base member in thermal contact with the at least one semiconductor target component

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

air cooling via pumping modules and air-to-liquid heat exchangers mounted on the UPS doors

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Data Source

PatentUS12402287B2Uninterruptible power supply having a liquid cooling device
Publication Date: 2025.08.26 OVH
  • US12402287B2 patent drawing
  • US12402287B2 patent drawing
  • US12402287B2 patent drawing

AI summary

A liquid cooling device for cooling at least one target component that includes: a base member to be in thermal contact with the at least one target component to be cooled by the liquid cooling device, the base member including a lower surface configured to be placed in contact with the at least one target component, the base member defining a plurality of pockets spaced apart from one another on an upper side thereof and defining a plurality of fluid conduits configured to internally circulate a cooling liquid therethrough. Each of the plurality of pockets arranged to accommodate a corresponding fluid conduit and an interconnecting channel defined by the base member and extending between two neighboring pockets of the plurality of pockets for distributing the cooling fluid from the fluid conduit of one pocket to the fluid conduit of a neighboring pocket.