Upside-Down LED Chip Mounting on PCB for Robustness
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Solution Overview
Problem
Existing light-emitting diode (LED) devices face challenges in miniaturization, cost-effectiveness, and mechanical robustness due to the need for sensitive bonding wires and complex assembly processes, which also result in reduced chip density and increased potential for mechanical damage and light reflections.
Innovation Solution
A light-emitting diode device is designed with the LED chip arranged upside down on a printed circuit board, allowing for a single assembly step without bonding wires, embedded between two printed circuit boards for enhanced robustness, and featuring a cover unit for protection and electrical contacting, enabling higher chip density and reduced lateral installation space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding wires are used to electrically connect LED chips to circuit board, then electrical connectivity is achieved, but mechanical robustness deteriorates and device complexity increases
Solution Approach 1:
The patent removes bonding wires from the LED device structure entirely. Instead of using wire bonds to connect LED chips to the circuit board, the invention directly mounts the LED chips (with emission side down) onto the circuit board, eliminating the bonding wire component and its associated assembly steps, thereby improving mechanical robustness and reducing device complexity
Solution Approach 2:
The patent inverts the conventional LED mounting approach by placing the emission side of the LED chip downward toward the circuit board instead of upward. This inversion allows direct electrical contact between the LED chip contacts and the circuit board, eliminating the need for bonding wires and simplifying the assembly process while improving mechanical reliability
2Ease of operation
If bonding wires and additional protective structures are used, then electrical connection is achieved, but lateral installation space increases
Solution Approach 1:
The patent extracts and removes bonding wires and aperture caps from the LED device structure. By eliminating these components, the lateral space required for wire routing and protective structures is freed up, allowing for higher chip density and more compact device design
Solution Approach 2:
The patent transitions from a lateral/wire-based connection approach to a vertical/direct-contact approach. By mounting LED chips with emission side down and making direct vertical contact with the circuit board, the invention eliminates the need for lateral wire routing, thereby reducing lateral installation space and enabling higher chip density
3Ease of manufacture
If conventional LED mounting with bonding wires is used, then electrical connection is achieved, but production cost increases
Solution Approach 1:
The patent removes bonding wires, aperture caps, and complex protective structures from the LED device. This extraction of unnecessary components simplifies the manufacturing process, reduces material costs, and eliminates expensive wire bonding and protective structure assembly steps, thereby improving ease of manufacture and reducing production cost
Solution Approach 2:
By inverting the LED chip mounting orientation (emission side down) and implementing direct contact with the circuit board, the patent eliminates the need for wire bonding and complex protective structures. This simplified approach reduces the number of assembly steps and material requirements, directly lowering production cost and improving ease of manufacture
Data Source
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AI summary
A light-emitting diode apparatus (100) comprises a light-emitting diode element (102) having a front (106) and a back (128), wherein the front (106) has an emission region (108) for emitting electromagnetic waves (110) and a diode connection contact (112) that is associated with the emission region (108), and comprises a printed circuit board (104) having a passage opening (114) and a plate connection contact (118), wherein the front (106) of the light-emitting diode element (102) is connected to the printed circuit board (104), and wherein the emission region (108) is arranged opposite the passage opening (114) and the diode connection contact (112) is arranged opposite the plate connection contact (118) and is electrically conductively connected to the plate connection contact (118). A cover unit (120) having a recess (122) for holding the light-emitting diode element (102) is connected to the printed circuit board (104), wherein the cover unit (120) is formed from a further printed circuit board.