Upside-Down Semiconductor Substrate Processing for Particle Removal
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Solution Overview
Problem
In semiconductor processing, the removal of particles, defects, and flakes during film deposition and lift-off processes often results in defects and malfunctions in electronic devices, as these contaminants tend to remain on the substrate surface.
Innovation Solution
The semiconductor processing system employs an upside-down wafer processing method where the substrate is held with its exposed surface facing downwards in a reactor chamber, utilizing a magnet to attract and a flowing process gas or plasma to remove particles and defects through gravitational and magnetic forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If films or layers are deposited onto semiconductor substrate surface and later removed by known methods, then material removal is achieved, but particles, defects, and flakes are generated on the wafer surface
Solution Approach 1:
The patent inverts the conventional processing orientation by placing the semiconductor substrate upside down in the reactor chamber, with the exposed surface facing downward. This inversion causes particles and defects to fall away from the substrate surface due to gravity, preventing their deposition on the wafer while still achieving material removal through the deposition and lift-off processes
2Ease of operation
If conventional processing methods are used with substrate facing upward, then standard processing operations can be performed, but particles and defects remain on the substrate surface
Solution Approach 1:
The patent reverses the conventional substrate orientation from upward-facing to downward-facing in the reactor chamber. This inversion maintains ease of operation by adapting standard processing procedures to the new orientation while simultaneously improving reliability by preventing particle and defect accumulation on the substrate surface
Solution Approach 2:
The patent converts the harmful effect of gravity, which normally causes particles to settle on the substrate surface, into a beneficial force by inverting the substrate orientation. Now gravity causes particles to fall away from the substrate, transforming a source of defects into a mechanism for particle removal and surface cleaning
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces or eliminates the deposition of particles and defects on the substrate, enhancing the reliability of semiconductor devices by ensuring cleaner surfaces during processing.
Implementation Method 1
disposing a magnet outside the reactor chamber such that a pole of the magnet is facing an exposed surface of the semiconductor substrate to distract material fragments or particles released from the semiconductor substrate
Implementation Method 2
taking away one or more particles, defects and flakes that have fallen down form the semiconductor substrate due to gravitational or magnetic forces, by any sort of flowing process gas or plasma in the direction of an outlet opening
Data Source
AI summary
The semiconductor processing system includes a reactor chamber that has an upper wall and a lower wall. A hold member is disposed in the reactor chamber to hold a semiconductor substrate in such a way that it faces the lower wall of the reactor chamber.