Upward Ejection Dispenser Shielding for Adhesive Smearing
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Solution Overview
Problem
Conventional electronic component mounting devices face issues with accurately coating adhesive agents, as the ejection hole and surrounding areas can become smeared, leading to undesirable adhesion, conduction failures, and increased operator burden due to cleaning requirements.
Innovation Solution
An electronic component mounting device with a dispenser that ejects adhesive agents upwardly, featuring a shield member positioned above the ejection hole to prevent smearing and ensure accurate coating, and a temporary use member that functions as a shield, measurement, and cleaning tool to manage adhesive agent distribution and removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If adhesive agent is ejected upwardly from an ejection hole, then accurate coating on the lower surface of the electronic component is achieved, but the ejection hole and surrounding areas become smeared causing conduction failures
Solution Approach 1:
A shield member is introduced as an intermediary element positioned between the ejection hole and the electronic component. This shield member has a through-hole that allows the adhesive agent to pass through and coat the component accurately, while the shield member itself blocks the adhesive agent from smearing onto surrounding areas and causing conduction failures.
Solution Approach 2:
The ejection system is segmented into distinct functional zones: the ejection hole for precise adhesive delivery, the shield member with through-hole for controlled passage and protection, and the electronic component receiving area. This segmentation isolates the adhesive agent flow path, preventing it from contacting and smearing the ejection hole surroundings while maintaining coating accuracy.
2Device complexity
If the ejection hole is exposed without shielding, then the structure is simple, but adhesive agent adheres to undesired areas increasing cleaning burden
Solution Approach 1:
The shield member serves as a protective intermediary that intercepts excess adhesive agent before it can adhere to undesired areas around the ejection hole. By positioning this shield between the ejection point and surrounding surfaces, the system reduces adhesive smearing and minimizes cleaning requirements without significantly complicating the dispenser structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the occurrence of defective products by preventing adhesive agent smearing and adhesion to undesired areas, enhancing the quality of electronic component mounting and reducing operator burden through automated cleaning and maintenance operations.
Implementation Method 1
a dispenser (6) which coats paste (P) being caused to fly out from upwardly opening ejection hole (42) against gravity
Data Source
AI summary
According to the present disclosure, an electronic component mounting device includes: a mounting head which picks up an electronic component from a part feeder, and transfers and mounts the electronic component on a board; a dispenser which applies a paste to a lower surface of the electronic component picked up by the mounting head, the paste being flied out from an ejection hole of the dispenser against gravity, the ejection hole opening upwardly; and a shield member which is disposed between the electronic component and the dispenser and has an opening above the ejection hole.