Urethane Heat Dissipation Composition Balancing Conductivity and Flexibility
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Solution Overview
Problem
Existing thermally conductive resins lack both sufficient thermal conductivity and flexibility, especially when increased filler content for better heat dissipation leads to reduced flexibility and efficiency.
Innovation Solution
A curable composition comprising a polyol with a molecular weight of 1000 or less, a polyisocyanate, and specific dispersants for inorganic fillers, along with a high filler content, to create a urethane resin with enhanced thermal conductivity and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the amount of heat dissipation filler is increased to enhance thermal conductivity, then thermal conductivity is improved, but flexibility is reduced
Solution Approach 1:
The patent changes the molecular weight parameter of the polyol to 1000 or less, which fundamentally alters the resin's physical properties. This parameter change enables the resin to maintain flexibility even with high filler content (70-97% by weight), resolving the contradiction between thermal conductivity and flexibility
Solution Approach 2:
The patent creates a composite material system combining low molecular weight polyol, polyisocyanate, and inorganic filler in specific proportions. This composite structure allows the resin to achieve both excellent thermal conductivity (1.5-6.5 W/m·K) and flexibility simultaneously
2Adaptability or versatility
If conventional polyurethane polymer is used to achieve flexibility, then flexibility is improved, but thermal conductivity is insufficient
Solution Approach 1:
The patent fundamentally changes the polyol molecular weight parameter to 1000 or less, which enables the resin to achieve both flexibility and high thermal conductivity. This parameter change is the key differentiator from conventional polyurethane polymers
Solution Approach 2:
The patent optimizes the local composition by using 50% or more polyalkylene glycol with molecular weight of 1000 or less in the polyol component, creating a specific local quality that enables simultaneous achievement of flexibility and thermal conductivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition results in a urethane resin with excellent thermal conductivity and flexibility, suitable for effective heat dissipation components.
Implementation Method 1
a polyol (A); a polyisocyanate (B)
Implementation Method 2
thermally conductive resins that can have both better thermal conductivity and better flexibility
Implementation Method 3
at least one dispersant (C) for inorganic fillers
Data Source
AI summary
The present invention aims to provide a urethane resin and a heat dissipation component each having excellent thermal conductivity and excellent flexibility. The present invention relates to a curable composition containing: a polyol (A); a polyisocyanate (B); at least one dispersant (C) for inorganic fillers selected from the group consisting of a phosphate ester (C1), a C12-C24 fatty acid (C2), a sucrose fatty acid ester (C3), a sorbitan fatty acid ester (C4), and a glycerol fatty acid ester (C5); and an inorganic filler (D), the curable composition satisfying the following requirements (1) to (3) that (1) the polyol (A) contains a polyalkylene glycol (A1) having a chemical formula weight or number average molecular weight of 1000 or less in an amount of 50% by weight or more based on the weight of the polyol (A); (2) the inorganic filler (D) is contained in an amount of 70 to 97% by weight based on the weight of the curable composition; and (3) the total weight of the dispersant (C) for inorganic fillers is 1 to 5 parts by weight per 100 parts by weight of the inorganic filler (D), the phosphate ester (C1) being represented by the following formula (1):