Interface Module Connector Shielding for USB 3.0 Noise
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Solution Overview
Problem
The existing interface modules for high-speed USB 3.0 data transmission between WLAN cards and host devices suffer from noise radiation, common-mode voltage issues, and impaired performance due to asymmetrical pin sequences and return-current loops, leading to degraded sensitivity and abnormal device operation.
Innovation Solution
The interface module incorporates a connector with a conductive case covering the second part and an absorptive material covering the pin elements and control circuit to enhance ground connection and absorb noise radiation, respectively, thereby reducing noise emissions during high-speed data transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If USB 3.0 standard is implemented for high-speed data transmission, then data transmission speed is improved, but noise radiation and common-mode voltage increase
Solution Approach 1:
The connector is divided into two parts: a first part covered by a non-conductive case and a second part covered by a conductive case. This segmentation allows different shielding strategies for different sections, reducing overall noise radiation while maintaining high-speed transmission capability.
Solution Approach 2:
Different materials are used for different parts of the connector case. The first part uses non-conductive material while the second part uses conductive material for shielding. This local differentiation optimizes the balance between signal integrity and noise reduction in specific areas.
2Adaptability or versatility
If asymmetrical pin sequence is used in USB 3.0 connector, then connector compatibility is improved, but common-mode performance and noise radiation worsen
Solution Approach 1:
The connector employs an asymmetrical pin sequence that is compatible with USB 3.0 standards while incorporating a symmetrical grounding structure through the conductive case. This resolves the conflict between asymmetrical pin requirements and symmetrical shielding needs for common-mode noise reduction.
Solution Approach 2:
The conductive case acts as an intermediary shielding structure between the asymmetrical pin elements and the external environment. It provides a symmetrical reference plane that mitigates common-mode voltage effects while allowing the asymmetrical pin sequence to maintain USB 3.0 compatibility.
3Object-affected harmful factors
If metal plug shell is connected to ground, then shielding effect is improved, but voltage difference and common-mode performance worsen due to return-current loops
Solution Approach 1:
The conductive case is designed to create an equipotential shielding environment around the connector pins. By maintaining a consistent electrical potential across the shielding structure, voltage differences caused by return-current loops are minimized, improving common-mode performance while preserving shielding effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces noise radiation across both low and high frequency ranges, preventing performance degradation and enhancing the throughput of wireless devices, ensuring stable operation during USB 3.0 transmission.
Implementation Method 1
a second part covered in a second case with a second depth... The second case is made of a conductive material
Implementation Method 2
covering the pin elements and control circuit by an absorptive material
Data Source
AI summary
An interface module coupled between a host device and a wireless device is disclosed. The interface module includes a connector, having a first part covered in a first case with a first depth and a second part covered in a second case with a second depth; and a control circuit coupled to the first part of the connector, for controlling data transmission between the host device and the wireless device; wherein the second case is made of a conductive material and which can be further covered by an absorptive material.