USB-C Connector Ground Plate Layout for Crosstalk and Warpage

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Solution Overview

Problem

The USB Type-C electrical connectors experience crosstalk between high frequency signal contact pairs due to the proximity of the ground plate, and the division of the ground plate into pieces leads to warpage and bending of the inner structure during insert molding, causing contact failures.

Innovation Solution

The electrical connector features a first and second ground plate arranged in a ground plane, with extending portions that overlap each other, ensuring continuous ground coverage and reducing stress on the inner structure, thereby preventing crosstalk and warpage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If the ground plate is placed close to the high frequency signal contact pairs to suppress crosstalk, then the crosstalk suppression is improved, but the ground plate causes warpage and bending of the inner structure during insert molding

Engineering Contradiction:
Improvecrosstalk between high frequency signal contact pairsVSAvoidwarpage and bending of inner structure
Core Design Contradiction:
Object-affected harmful factorsVSStability of the object's composition

Solution Approach 1:

The ground plate is divided into multiple separate ground plates (first ground plate and second ground plate) positioned at different locations. This segmentation allows each ground plate to be optimally positioned for crosstalk suppression without creating excessive stress concentration that would cause warpage, as the stress is distributed across multiple smaller ground plates rather than one large continuous plate

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the connector are assigned different ground plate configurations. The ground plates are strategically positioned near high frequency signal contact pairs where crosstalk suppression is most critical, while avoiding areas where they would cause excessive stress during molding. This local optimization allows crosstalk suppression where needed without compromising overall structural stability

Inventive Principle:
Principle #3Local quality

2Stability of the object's composition

If the ground plate is divided into pieces to prevent warpage, then the structural stability is improved, but the crosstalk suppression between high frequency signal contact pairs deteriorates

Engineering Contradiction:
Improvewarpage and bending of inner structureVSAvoidcrosstalk between high frequency signal contact pairs
Core Design Contradiction:
Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The ground plate is divided into multiple separate ground plates (first ground plate and second ground plate) positioned at different locations. This segmentation allows each ground plate to be optimally positioned for crosstalk suppression without creating excessive stress concentration that would cause warpage, as the stress is distributed across multiple smaller ground plates rather than one large continuous plate

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The insulator serves as an intermediary material between the divided ground plates and the housing. It provides mechanical support and stress distribution, allowing the ground plates to be positioned effectively for crosstalk suppression while the insulator absorbs and distributes the molding stress to prevent warpage of the overall inner structure

Inventive Principle:
Principle #24Intermediary (Mediator)

3Stability of the object's composition

If the ground plate is made continuous to provide uniform stress distribution, then the prevention of warpage is improved, but the crosstalk between high frequency signal contact pairs increases

Engineering Contradiction:
Improvewarpage and bending of inner structureVSAvoidcrosstalk between high frequency signal contact pairs
Core Design Contradiction:
Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The ground plate is divided into multiple separate ground plates (first ground plate and second ground plate) positioned at different locations. This segmentation allows each ground plate to be optimally positioned for crosstalk suppression without creating excessive stress concentration that would cause warpage, as the stress is distributed across multiple smaller ground plates rather than one large continuous plate

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple ground plates are positioned at different locations throughout the connector, effectively copying the grounding function to multiple sites. This allows uniform stress distribution similar to a continuous ground plate, while each individual ground plate can be optimized for local crosstalk suppression near specific high frequency signal contact pairs

Inventive Principle:
Principle #26Copying

Data Source

PatentUS12062871B2Electrical connector and electronic device
Publication Date: 2024.08.13 MITSUMI ELECTRIC CO LTD
  • US12062871B2 patent drawing
  • US12062871B2 patent drawing
  • US12062871B2 patent drawing

AI summary

An electrical connector contains a plurality of contacts, a first ground plate and a second ground plate facing the plurality of contacts and arranged so as to be separated from each other in a ground plane parallel to the at least one plane in which the plurality of contacts are arranged and an insulator for holding the plurality of contacts, the first ground plate and the second ground plate in a state that the plurality of contacts, the first ground plate and the second ground plate are insulated from each other. Both of the first ground plate and the second ground plate include an extending portion extending from one of the first ground plate and the second ground plate toward the other one of the first ground plate and the second ground plate in the ground plane.