Ultra-thin USB-C Connector Seamless Housing Design

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional USB-C connectors are bulky and aesthetically unappealing due to external overmolds, which can cause damage and awkward device positioning when plugged into thinner computing devices, and they often suffer from signal drop issues due to cable design.

Innovation Solution

A USB-C connector design with a seamless, thin housing that eliminates external overmolds and features a unique cable configuration with multiple wires arranged side-by-side for efficient power and data transmission, along with strain relief and insulation, to maintain a thin profile while minimizing signal loss.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If external overmolds are added to USB-C connectors for protection and structure, then strength and durability are improved, but the connector becomes bulky and aesthetically unappealing

Engineering Contradiction:
Improveconnector durabilityVSAvoidconnector size
Core Design Contradiction:
StrengthVSVolume of moving object

Solution Approach 1:

The patent removes the external overmold layer from conventional USB-C connectors, extracting only the essential protective and structural functions to the housing itself. This eliminates the bulky appearance while maintaining necessary strength through optimized housing design and material selection.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent employs a thin-film housing structure that provides protective functions without the bulk of traditional overmolds. The housing is designed with sufficient structural integrity to protect internal components while maintaining a sleek, thin profile that matches modern device aesthetics.

Inventive Principle:
Principle #30Flexible shells and thin films

2Reliability

If conventional cable designs are used with USB-C connectors, then ease of manufacture is maintained, but signal drop issues occur due to cable configuration

Engineering Contradiction:
Improvesignal transmission qualityVSAvoidcable assembly complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent transitions from traditional twisted-pair wire arrangements to a side-by-side parallel wire configuration within the cable. This dimensional change in wire layout optimizes signal transmission by reducing electromagnetic interference and signal drop, while the modular connector design maintains manufacturing efficiency.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Length of moving object

If USB-C connectors are made thinner to match device profiles, then aesthetics and device integration are improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improveconnector thicknessVSAvoidhousing thickness tolerance
Core Design Contradiction:
Length of moving objectVSManufacturing precision

Solution Approach 1:

The patent optimizes housing thickness parameters and material properties to achieve the desired thin profile while maintaining structural integrity. By carefully selecting material strength characteristics and optimizing wall thickness distributions, the connector achieves a sleek appearance without requiring excessively tight manufacturing tolerances.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS10014638B1Ultra-thin USB-C connector
Publication Date: 2018.07.03 MICROSOFT TECHNOLOGY LICENSING LLC
  • US10014638B1 patent drawing
  • US10014638B1 patent drawing
  • US10014638B1 patent drawing

AI summary

A USB-C connector includes a plug tip and a cable. The USB-C connector includes a single, seamless, continuous, thin housing protecting a wire termination and contacts within the housing. The housing has a uniform thickness along the entire length of the housing. The housing may provide strain relief to the cable and an aesthetically pleasing USB-C connector. The connector may include an overmold residing inside the housing and over the wire termination and contacts.