USB 3.1 Type-C Connector Single-Row Soldering Alignment
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Solution Overview
Problem
Conventional USB 3.1 Type-C connectors face challenges in the soldering process due to complex terminal alignment, leading to decreased yield rates and issues like solder skip or short circuits.
Innovation Solution
The electrical receptacle connector arranges soldering sections of multiple terminals in a single row, with the first and second terminal sets aligned at the same horizontal plane, allowing for simultaneous soldering and simplifying the process, thereby reducing the risk of solder skip and short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If two terminal sets are aligned in two rows with identical pin assignments in grounding terminals or power terminals, then the connector can provide signal transmission and power transmission, but the soldering process becomes complicated and yield rate decreases
Solution Approach 1:
The patent repositions the soldering sections from a two-row arrangement to a single-row arrangement by utilizing the horizontal plane dimension. The first and second terminal sets are arranged such that their soldering sections align horizontally, transforming a complex two-dimensional soldering pattern into a simplified one-dimensional linear arrangement, thereby resolving the contradiction between connectivity capability and soldering productivity
Data Source
AI summary
An electrical receptacle connector has an insulated housing. A first terminal set and a second terminal set are held in the insulated housing. The first terminal set has two first grounding terminals, two first power terminals and multiple signal terminals. Each one of the terminals of the first terminal set has a first soldering section. The second terminal set has two second grounding terminals, two second power terminals and multiple signal terminals. Each one of the terminals of the second terminal set has a second soldering section. The second soldering sections of the second grounding terminals are located next to the first soldering sections of the first grounding terminals. The second soldering sections of the second power terminals are located next to the first soldering sections of the first power terminals. A soldering process of the connecter is improved by clustering the grounding terminals and the power terminals.