Vertical Surface Mount USB Connector with Flexible Cable Routing
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Solution Overview
Problem
Current USB devices and system-in-a-package (SIP) designs face challenges in efficiently routing signals between substrate sections while ensuring electrical safety and mechanical stability, particularly in compact form factors like mobile devices and removable storage devices.
Innovation Solution
The design incorporates a flexible cable connecting two substrate sections with a surface-mounted connector and semiconductor die stack, using mold compound layers for insulation and mechanical stability, and bonding wires for electrical connections, allowing for signal propagation and secure mounting of pins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a flexible cable connects two substrate sections with a surface-mounted connector, then signal routing efficiency is improved, but device complexity increases
Solution Approach 1:
The device is divided into two separate substrate sections (first substrate section and second substrate section) connected by a flexible cable. This segmentation allows independent optimization of each substrate while maintaining efficient signal routing through the cable connection, resolving the contradiction between routing efficiency and device complexity.
2Reliability
If mold compound layers are used for insulation and mechanical stability, then reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
Mold compound layers are applied over the flexible cable and connector components to create a composite structure that provides both electrical insulation and mechanical stability. This composite material approach consolidates multiple functions (insulation, protection, structural support) into a single material layer, reducing the need for precise manufacturing tolerances while maintaining reliability.
3Adaptability or versatility
If bonding wires are used for electrical connections, then connectivity is improved, but vulnerability to damage increases
Solution Approach 1:
The mold compound layers are positioned to cover and protect the bonding wires before they can be exposed to damage. This protective encapsulation provides mechanical cushioning and environmental protection to the vulnerable bonding wires while maintaining their electrical connectivity function, resolving the contradiction between connectivity and durability.
4Volume of moving object
If a compact form factor is implemented, then portability is improved, but signal routing difficulty increases
Solution Approach 1:
The flexible cable enables three-dimensional signal routing between substrate sections within the compact form factor. By utilizing vertical and angular dimensions rather than only linear horizontal routing, the design achieves efficient signal connectivity in a minimized volume, resolving the contradiction between compactness and routing difficulty.
Data Source
AI summary
Semiconductor substrate sections joined by an integral flexible cable are utilized to form a device comprising a connector. The connector can be surface mounted on through-holes and soldered for enhanced robustness.