USB Connector Grounding Path for Signal Integrity

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Solution Overview

Problem

Existing USB device designs face challenges in modifying existing designs to comply with new standards, such as increased cost, complexity, and size, while maintaining compatibility with multiple standards like USB 2.0 and USB 3.0, and addressing noise issues for high-speed signal transmission.

Innovation Solution

A USB device configuration that includes a connectorized memory module with conductive shroud and ground contacts, allowing for compliance with both USB 2.0 and USB 3.0 standards, featuring solderless connections and a conductive shroud that provides a grounding path for noise reduction, enabling high-speed signal transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If existing USB device design is modified to comply with new standards (USB 3.0), then compliance with new standards is achieved, but cost and complexity increase

Engineering Contradiction:

Improvecompliance with USB standardsVSAvoiddevice complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The memory module is designed with dual functionality to support both USB 2.0 and USB 3.0 standards. The module includes contact pads configured for USB 2.0 compliance and additional contact pads for USB 3.0 compliance, allowing a single device design to meet multiple standards without requiring separate designs for each standard

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent combines USB 2.0 and USB 3.0 connectivity features into a single memory module design. The module integrates both USB 2.0 contact pads and USB 3.0 contact pads, along with ground pads, into one unified structure that can operate under either standard, thereby reducing overall device complexity compared to having separate modules for each standard

Inventive Principle:

Principle #5Merging (Combining)

2Adaptability or versatility

If existing USB device design is modified to comply with new standards (USB 3.0), then compliance with new standards is achieved, but manufacturing cost increases

Engineering Contradiction:

Improvecompliance with USB standardsVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The contact pads on the memory module are segmented into distinct groups: USB 2.0 contact pads, USB 3.0 contact pads, and ground pads. This segmentation allows selective use of contacts based on the required standard, enabling cost-effective manufacturing by only activating the necessary contact sets for each application

Inventive Principle:

Principle #1Segmentation

3Reliability

If ground contacts are added for high-speed signal transmission, then noise is reduced and signal integrity is improved, but device complexity increases

Engineering Contradiction:

Improvesignal integrityVSAvoiddevice complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The ground pads are integrated directly into the memory module substrate alongside the signal contact pads. This merging of ground and signal paths into a single module structure provides effective noise reduction and signal integrity improvement without requiring separate ground shielding components, thereby avoiding additional device complexity

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The ground pads act as intermediary elements between the signal contact pads and the USB connector housing. These ground pads provide a reference potential and noise sink that mediates electromagnetic interference, ensuring clean high-speed signal transmission while maintaining a simple module-level implementation

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables cost-effective and reliable USB devices that maintain compatibility with multiple standards, reducing manufacturing costs and enhancing signal integrity by providing a grounding path for noise reduction, thus supporting high-speed USB 3.0 operations.

Implementation Method 1

The conductive shroud may operate as a clamping force to enable one or more metal connectors of the second carrier to be in contact with one or more contact pads of the memory module

Methodology Applied

Scientific EffectGrounding path: Conduction (electrical)

Data Source

PatentUS8986050B2Connector of a universal serial bus device

Publication Date: 2015.03.24 SANDISK TECHNOLOGIES LLC

AI summary

In a particular embodiment, a connector includes a connector module and a set of conductive connectors coupled to the connector module. The set of conductive connectors is configured to electrically couple to a set of contacts of a memory module. The connector also includes a ground contact coupled to the connector module. The ground contact is configured to be coupled to a ground of the memory module and to a conductive shroud.