Integrated USB Connector Memory Module Thermal Design
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Solution Overview
Problem
Conventional USB devices have a large footprint due to separate memory and connector components, leading to protrusion issues and heat dissipation problems, which can cause operational inefficiencies and mechanical vulnerabilities.
Innovation Solution
An integrated USB device design that combines a system-in-package (SIP) module with a USB connector, featuring a compact layout and efficient heat transfer through thermal pads and metal contacts, allowing for better thermal conduction and reduced size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the memory portion and USB connector are formed separately and affixed together, then the device can be manufactured using conventional processes, but the device has a relatively large footprint and protrudes from the USB slot
Solution Approach 1:
The patent merges the memory portion and USB connector into a single integrated unit where the connector is formed directly on the memory portion substrate. This eliminates the need for separate assembly steps while reducing the overall device footprint by removing gaps and mounting structures between separate components.
Solution Approach 2:
The patent transitions from a three-dimensional assembly of separate components to a planar two-dimensional integration where the connector traces are laid out on the same substrate as the memory chips, reducing the vertical profile and overall footprint of the device.
2Ease of manufacture
If the memory portion and USB connector are formed separately, then manufacturing is easier, but heat dissipation becomes difficult affecting memory speed and operation
Solution Approach 1:
By integrating the connector directly on the memory portion substrate, the patent creates continuous thermal pathways between the memory chips, connector, and substrate. This merged structure enables more efficient heat dissipation compared to separate components with thermal gaps at mounting interfaces.
3Ease of manufacture
If the device has a large footprint, then manufacturing is simpler, but the protruding USB device can catch and break during storage or transport
Solution Approach 1:
The integration of connector and memory portion into a single compact unit eliminates the protruding structure that is prone to mechanical damage. The merged design reduces the overhang and exposure of vulnerable components during storage and transport.
4Area of stationary object
If an integrated design is used, then the footprint is reduced and heat dissipation is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent segments the integrated design into modular functional blocks (memory chips, connector traces, shielding) that can be independently designed and then assembled using standardized processes. This segmentation reduces the complexity of the overall fabrication while maintaining the benefits of integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated design enhances heat dissipation and reduces the device's footprint, improving operational efficiency and mechanical stability by allowing for more effective heat transfer and a smaller form factor.
Implementation Method 1
efficient heat transfer through thermal pads and metal contacts, allowing for better thermal conduction
Data Source
AI summary
A USB device is disclosed including an integrated memory module and USB connector. Integration of the memory module with the USB connector according to the present technology provides a USB device with a compact footprint and efficient heat transfer to a host device in which the USB device is used.