System Board Interface Routing for Multi-Standard USB Support
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Solution Overview
Problem
The production and cost of system boards with various USB standards are increased due to the need for different designs to support different data transmission rates, as higher rates require additional components like integrated circuits.
Innovation Solution
An interface arrangement on a system board with two data lines for differential signal transmission, multiple mounting locations for connectors, and an optional integrated circuit, allowing signals to route through different paths based on the standard supported, enabling a uniform board design regardless of the USB standard.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different system board configurations are used to support different USB standards, then multiple USB standards can be supported, but production complexity and cost increase
Solution Approach 1:
The system board is designed with a universal interface arrangement that can support multiple USB standards (USB 2.0, USB 3.0, USB 3.1 Gen 1, USB 3.1 Gen 2) through a single standardized layout. The data lines are configured to work across different standards without requiring separate board designs, allowing one board to perform multiple functions and support various USB generations.
Solution Approach 2:
The interface arrangement incorporates optional integrated circuits that can be selectively installed depending on the required USB standard. This dynamic configuration allows the same physical board to adapt to different performance requirements by adding or removing specific components, particularly for achieving higher data transmission rates in USB 3.1 Gen 2 implementations.
2Adaptability or versatility
If different system board configurations are used to support different USB standards, then multiple USB standards can be supported, but production cost increases
Solution Approach 1:
By creating a universal board design that supports multiple USB standards through standardized data line configurations and optional component placement, the manufacturer produces a single board type rather than multiple specialized boards. This reduces tooling costs, simplifies inventory management, and lowers per-unit production costs while maintaining support for USB 2.0, 3.0, 3.1 Gen 1, and 3.1 Gen 2.
Solution Approach 2:
The system allows parameter changes in data transmission rate by selectively installing integrated circuits or adjusting connector positions, rather than changing the entire board design. This enables cost-effective adaptation to different USB standards by modifying only specific parameters (data rate, signal routing) through component selection and mounting variations.
3Speed
If optional integrated circuits are used for higher data rates, then higher USB standards can be supported, but component usage and complexity increase
Solution Approach 1:
The interface arrangement uses optional integrated circuits that are selectively installed based on the required data transmission rate. For USB 2.0 and USB 3.0, no additional circuits are needed. For USB 3.1 Gen 1 and Gen 2, specific integrated circuits are added to achieve the required speeds. This dynamic component configuration allows the system to scale complexity only when higher performance is needed.
Solution Approach 2:
The interface arrangement segments the signal paths into different routes: a first path for basic USB standards and a second path for higher-speed standards requiring integrated circuits. This segmentation allows selective activation of complex components only when needed, keeping the basic system simple while enabling high-performance modes through optional additions rather than requiring all components to be present in every configuration.
Data Source
AI summary
An interface arrangement on a system board includes at least two data lines for a differential signal transmission, at least one first mounting location for at least one first connector and at least one second mounting location for at least one second connector, and a third mounting location for an integrated circuit, wherein at the at least one first mounting location the data lines are divided into first and second paths, at the at least one second mounting location, the second and first paths are joined, the third mounting location for the integrated circuit is arranged in the first path, and the at least one and second connectors can be mounted at the at least one first and second mounting locations in a first or a second position, respectively, so that signals in the data lines run via the first path or via the second path.