USB Memory Connector Height Control via Adhesive Film

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Solution Overview

Problem

The existing USB memory manufacturing methods face challenges in accurately controlling the mounting height of connector components due to unstable solder supply and surface tension, limiting design freedom and compatibility with receptacles.

Innovation Solution

The use of an adhesive film between the wiring board and the connector holder allows for precise control of the connector's height, enabling accurate positioning and improved design flexibility by providing a consistent and controlled thickness, which is not dependent on solder paste variability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If solder mounting is used to connect the connector component to the substrate, then electrical connection is achieved, but the mounting height becomes unstable and difficult to control

Engineering Contradiction:
Improveelectrical connectionVSAvoidmounting height
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent introduces a support member as an intermediary component between the substrate and the connector component. This support member has a predetermined height that actively controls and stabilizes the mounting height of the connector component, while the solder mounting process maintains the electrical connection function. The support member acts as a mediator that resolves the conflict between reliable electrical connection and precise height control.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If solder paste is used for mounting, then the connector component can be electrically connected, but the solder supply amount becomes unstable

Engineering Contradiction:
Improveelectrical connectionVSAvoidsolder supply amount
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent segments the mounting structure into three distinct functional parts: the substrate, the support member with predetermined height, and the connector component. This segmentation separates the height control function (handled by the support member) from the electrical connection function (handled by the solder), allowing each to be optimized independently without interfering with the other.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The support member serves as an intermediary that stabilizes the mounting height, thereby stabilizing the solder supply amount needed for electrical connection. By providing a consistent reference height, the support member ensures stable solder application and reliable electrical connection between the substrate and connector component.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of manufacture

If the mounting height is affected by the mounter and surface tension, then the connector can be mounted, but active control of the mounting height becomes difficult

Engineering Contradiction:
Improvemounting processVSAvoidmounting height control
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The support member is designed with a predetermined height before the mounting process begins. This preliminary determination of the mounting height allows active control of the connector component's position relative to the substrate, independent of variations in the mounter or surface tension effects during the actual mounting process.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces the variation in connector height, enhancing the USB memory's design freedom and ensuring reliable electrical connections by stabilizing the connector's position relative to the receptacle, thus facilitating easier assembly and reducing the risk of interference or non-connection issues.

Implementation Method 1

an adhesive film is provided at least between the wiring board and the holder

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS11880609B2USB memory and manufacturing method thereof
Publication Date: 2024.01.23 KIOXIA CORP
  • US11880609B2 patent drawing
  • US11880609B2 patent drawing
  • US11880609B2 patent drawing

AI summary

A USB memory according to a present embodiment is the USB memory capable of data transfer by being connected with a receptacle, and includes a wiring board, a semiconductor chip, a connector, and an adhesive film. The wiring board includes wiring. The semiconductor chip is electrically connected with the wiring. The connector includes a first connection, a second connection, and a holder. The first connection is electrically connected with the semiconductor chip via the wiring. The second connection is electrically connected with the first connection and is connectable with the receptacle. The holder holds the first connection and the second connection. The adhesive film is provided at least between the wiring board and the holder.