USB Pin Module With Segmented Planar Electrodes
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Solution Overview
Problem
Existing USB devices face challenges in providing corrosion-resistant and mechanically reliable connections, especially with the transition to USB 3.0 standards, which require improved transfer speeds and durability.
Innovation Solution
A USB device design featuring a pin module with conductive pins and a nonconductive fixing unit, integrated with a substrate and sealing material, providing electrical connections for both USB 2.0 and USB 3.0 signals, and allowing for secure insertion and contact with a host device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional connection methods are used, then manufacturing is simpler, but corrosion resistance and mechanical reliability are insufficient
Solution Approach 1:
The connection structure is divided into separate planar electrodes on the substrate and corresponding pins on the plug, with sealing material applied selectively to protect the electrodes while maintaining pin accessibility. This segmentation allows independent optimization of corrosion protection and mechanical connection.
Solution Approach 2:
The patent employs composite material structures including conductive pins with insulating coatings, sealed electrode regions with protective sealing material, and the integration of multiple materials (metal, polymer, conductive paste) to achieve both corrosion resistance and mechanical strength in the connection interface.
2Speed
If USB 3.0 standards are implemented, then transfer speed improves, but connection durability and corrosion resistance become challenges
Solution Approach 1:
Sealing material is applied to the planar electrodes before the plug is inserted, pre-establishing a corrosion-resistant barrier that protects the electrical contacts throughout the device's operational life, ensuring long-term durability for high-speed USB 3.0 connections.
Solution Approach 2:
The patent modifies the physical and chemical parameters of the connection interface by applying sealing material with specific protective properties, changing the surface characteristics of the electrodes to resist corrosion while maintaining electrical conductivity, thereby ensuring reliability for USB 3.0 transfer speeds.
3Reliability
If pins are always in contact with electrodes, then electrical connection is maintained, but corrosion risk increases
Solution Approach 1:
The sealing material is applied selectively only to specific regions of the planar electrodes that are not in direct contact with the pins, creating local protection zones. This allows the connection interface to maintain electrical stability while the sealed regions remain protected from corrosion.
Solution Approach 2:
The sealing material acts as an intermediary protective layer between the planar electrodes and the corrosive environment, allowing electrical connection to occur through the pins and electrodes while the sealing material mediates protection for the exposed electrode surfaces.
Data Source
AI summary
Provided are a pin module and a universal serial bus (USB) device. The USB device includes: a substrate including a first side and a second side, the second side opposite to the first side; at least one memory chip mounted on the first side of the substrate; at least one controller chip mounted on the first side of the substrate; a plurality of first planar electrodes formed on the second side of the substrate; a plurality of second planar electrodes formed on the second side of the substrate; and a sealing material housing the memory chip, the controller chip, the first planar electrodes, and the second planar electrodes, wherein the sealing material exposes one sides of the first planar electrodes and the second planar electrodes.