USB 3.0 Connector Lead Arrangement Surface Mount Parasitic Capacitance
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Solution Overview
Problem
Existing USB 3.0 electric connectors face challenges in maintaining high-speed signal transmission quality due to parasitic capacitance caused by differential signal leads being soldered through vias, which affects signal propagation and transmission speed.
Innovation Solution
The proposed lead arrangement includes surface mounting segments for critical differential signal leads and a ground lead on the circuit board, reducing parasitic capacitance and improving signal quality by distributing high-speed signals over the surface metal layer, while maintaining compatibility with existing USB 2.0 structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If differential signal leads are soldered through vias, then mechanical connection and structural simplicity are improved, but parasitic capacitance increases and signal quality deteriorates
Solution Approach 1:
The patent extracts the differential signal leads from the traditional through-via soldering path and repositions them to be soldered directly to surface pads on the circuit board surface. This extraction removes the via structure that generates parasitic capacitance, thereby reducing harmful electromagnetic effects while maintaining mechanical connection and structural simplicity.
Solution Approach 2:
The patent transitions the soldering connection from a vertical through-via path (three-dimensional penetration) to a horizontal surface mounting path (two-dimensional surface connection). This dimensional change eliminates the via structure and associated parasitic capacitance while maintaining electrical connectivity and mechanical strength.
2Productivity
If differential signal leads are soldered through vias, then manufacturing process is simplified, but transmission speed and signal channel quality deteriorate
Solution Approach 1:
The patent extracts the signal transmission path from the via structure to the circuit board surface, removing the source of signal degradation. This allows high-speed USB 3.0 signals to propagate without the parasitic capacitance bottleneck, achieving 5 Gbps transmission speeds while maintaining manufacturing efficiency through standard surface mount technology.
3Object-affected harmful factors
If ground lead is positioned between differential signal leads, then signal shielding and noise reduction are improved, but lead arrangement complexity increases
Solution Approach 1:
The patent merges the ground lead function with the surface mounting structure by positioning the ground lead between the differential signal leads and soldering all three to adjacent surface pads. This combining approach provides effective electromagnetic shielding and noise reduction while maintaining a simple, standardized surface mount configuration that does not increase overall complexity.
Data Source
AI summary
A lead arrangement is provided for an electric connector. The lead arrangement includes a first lead lane that includes a pair of first differential signal leads, a pair of second differential signal leads and a first ground lead between the two pairs of differential signal leads. Each of the first differential signal leads, the second differential signal leads and the ground lead has a surface mounting segment adapted for being soldered onto a surface pad of a circuit board. The pair of first differential signal leads is a pair of transmitting differential signal leads Tx+ and Tx− in architecture of universal serial bus 3.0 (USB 3.0), and the pair of second differential signal leads is a pair of receiving differential signal leads Rx+ and Rx− in architecture of USB 3.0.