UTG Etching Window Process With Mask Cooling and Temperature Control
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Solution Overview
Problem
Existing etching methods for ultra-thin glass (UTG) used in foldable display devices lack efficiency and reliability, hindering the production of foldable windows with consistent quality.
Innovation Solution
An etching device with a stage, nozzle part, mask part, and lower cooling part is employed, utilizing temperature-controlled etching solutions and cooling patterns to etch UTG substrates, ensuring precise exposure and controlled etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional etching methods are used for UTG, then the etching process can be completed, but the reliability and foldability of the UTG window are insufficient
Solution Approach 1:
The patent applies local quality by using different temperature etching solutions for different regions of the UTG substrate. A first etching solution at a lower temperature (10-20°C) is used for non-foldable regions, while a second etching solution at a higher temperature (30-40°C) is used for foldable regions. This localized temperature control enables precise control of etching rates in different areas, improving both reliability and foldability while maintaining production efficiency.
Solution Approach 2:
The patent changes the temperature parameter of the etching solution to control the etching process. By adjusting the temperature of the etching solution between 10-40°C depending on the region, the etching rate is precisely controlled to create the desired foldable properties in specific areas while maintaining structural integrity in non-foldable areas, thereby improving overall reliability.
2Manufacturing precision
If temperature-controlled etching solutions are used, then etching precision is improved, but process complexity increases
Solution Approach 1:
The patent segments the etching process into multiple stages with different temperature solutions. The first etching solution at lower temperature is applied first to non-foldable regions, followed by the second etching solution at higher temperature for foldable regions. This segmentation allows precise control of etching depth and rate in different areas, achieving high manufacturing precision while managing process complexity through systematic division of steps.
Solution Approach 2:
The patent applies preliminary action by first treating the non-foldable regions with the lower temperature etching solution before proceeding to the foldable regions with the higher temperature solution. This preliminary etching step establishes a foundation and prevents over-etching in non-foldable areas, enabling better overall control of the etching process and improved precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the reliability and foldability of UTG windows by maintaining precise etching control and reducing step differences, improving the manufacturing process's efficiency and product quality.
Implementation Method 1
a lower cooling part disposed between the stage and the target substrate... the lower cooling part may maintain a temperature equal to or greater than about 0 degrees Celsius and equal to or less than about 10 degrees Celsius
Implementation Method 2
the nozzle part sprays an etching solution toward the stage... providing an etching solution onto the mask part and the portion of the target substrate exposed through the opening
Data Source
AI summary
An etching device includes a stage on which a target substrate is disposed, a nozzle part disposed to face the stage with the target substrate interposed therebetween, where the nozzle sprays an etching solution toward the stage, a mask part disposed between the target substrate and the nozzle part, where the mask part includes a first pattern including a first side surface extending in a first direction, and a second pattern spaced apart from the first pattern in a second direction intersecting the first direction and including a second side surface extending in the first direction, and an opening is defined by the first side surface and the second side surface to expose a portion of the target substrate, and a lower cooling part disposed between the stage and the target substrate.