UV Surface Activation Bonding for Dust-Resistant Wafer Joining
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Solution Overview
Problem
Existing bonding technologies face challenges in maintaining bonding strength due to dust adhesion and deterioration of hydrophilization performance over time, particularly when there is a gap between hydrophilization and bonding processes.
Innovation Solution
A bonding device that uses ultraviolet irradiation to hydrophilize the surfaces of components immediately before bonding, reducing the time between hydrophilization and bonding, and incorporating a conveyor system to efficiently bring the components into contact, thereby minimizing dust adhesion and maintaining strong hydrophilic properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the time between hydrophilization and bonding is extended, then the components can be handled and positioned, but dust adhesion increases and bonding strength decreases
Solution Approach 1:
The patent combines the hydrophilization process and bonding process into a single integrated device. The ultraviolet irradiator activates the surfaces, and the conveyor immediately transports them to the bonding position without transferring to another device, eliminating the time gap that causes dust adhesion while maintaining operational capability.
Solution Approach 2:
The ultraviolet irradiator performs preliminary hydrophilization activation of the component surfaces before bonding. This preliminary action creates the necessary surface properties for bonding, and the conveyor then quickly moves the activated surfaces to the bonding position, minimizing the time the activated surfaces are exposed to dust.
2Ease of manufacture
If separate devices are used for hydrophilization and bonding, then each process can be optimized independently, but the overall process time increases and dust contamination risk increases
Solution Approach 1:
The patent merges the ultraviolet irradiation system and bonding system into a single integrated device. The irradiator is positioned within the same device as the bonding chamber, and the conveyor connects the irradiation area directly to the bonding area, allowing both processes to occur in sequence without device transfer, thus reducing total process time and dust exposure.
Solution Approach 2:
The conveyor system enables continuous operation by immediately transporting components from the ultraviolet irradiation zone to the bonding zone without interruption. This continuous action eliminates idle time between processes and maintains the components in a controlled environment, preventing dust contamination while preserving the ability to optimize each process parameter independently.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances bonding strength by reducing the time for hydrophilization and bonding, suppressing dust adhesion and performance deterioration, and allowing for efficient bonding of components made of different materials.
Implementation Method 1
an irradiator that irradiates a surface of a first component with ultraviolet rays
Implementation Method 2
hydrophilizing the surface of the silicon (Si) wafer using oxygen plasma
Implementation Method 3
brings the surface of the first component and the surface of the second component into contact with each other to bond the first component and the second component
Data Source
AI summary
A bonding device includes an irradiator that irradiates a surface of a first component with ultraviolet rays, and a conveyor that conveys the first component, wherein the irradiator irradiates the first component held by the conveyor with the ultraviolet ray, and the conveyor conveys the first component irradiated with the ultraviolet rays to a surface of a second component, and brings the surface of the first component and the surface of the second component into contact with each other to bond the first component and the second component.