Ramped UV Adhesive Cure for Optical Transceiver Alignment
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Solution Overview
Problem
Optical transceivers face misalignment issues during the adhesive curing process, leading to production output losses due to shifting components, which fail to meet quality control and performance requirements.
Innovation Solution
A method involving a UV-active adhesive applied to alignment-sensitive components, with a two-stage UV radiation process: a low dose to solidify the outer layer and a high dose to solidify the remaining adhesive, using an adjustable base and controllable UV light-emitting devices to maintain component alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a high dose of UV radiation is applied to solidify the adhesive quickly, then the adhesive curing speed is improved, but the alignment-sensitive components shift or move during the process
Solution Approach 1:
The UV radiation process is segmented into multiple stages with different radiation doses. A first relatively low dose solidifies the outer layer of the adhesive, and a second relatively high dose solidifies the remaining thickness. This segmentation allows the adhesive to set progressively without causing component shift, resolving the contradiction between curing speed and alignment precision.
Solution Approach 2:
The first low dose UV radiation is applied as a preliminary action to solidify the outer layer of the adhesive before the main high dose radiation. This preliminary solidification creates a stable structure that prevents component shifting during the subsequent high-dose curing process, enabling both precision and speed.
2Manufacturing precision
If a low dose of UV radiation is applied to prevent component shifting, then the alignment precision is improved, but the adhesive solidification time increases
Solution Approach 1:
The curing process is divided into two segmented stages: a first low-dose stage that prevents shifting and maintains alignment, and a second high-dose stage that completes the solidification quickly. This segmentation allows the process to benefit from both low-dose precision and high-dose speed, resolving the time-loss issue.
Solution Approach 2:
The two-stage UV radiation process operates continuously without interruption. The first low-dose radiation maintains alignment while the second high-dose radiation completes curing, ensuring continuous useful action throughout the process and minimizing total solidification time despite the two-stage approach.
3Loss of time
If the adhesive is solidified completely at once, then the total curing time is reduced, but the components shift or move during solidification
Solution Approach 1:
The complete solidification is segmented into two distinct radiation doses applied in sequence. The first dose creates initial stability preventing shifts, and the second dose completes the process. This segmentation maintains position stability throughout while achieving complete solidification efficiently.
Solution Approach 2:
The first low-dose UV radiation serves as a preliminary action that stabilizes component positions before the main solidification process. This preliminary stabilization prevents shifting during the subsequent high-dose curing, ensuring both stability and time efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces component shifting, ensures stable alignment, and shortens the adhesive solidification time, increasing manufacturing yield and compliance with industry standards.
Implementation Method 1
applying a first, relatively low dose of UV radiation to the adhesive; applying a second, relatively high dose of UV radiation to the adhesive
Implementation Method 2
UV-active adhesive or glue; sufficient to solidify an outer layer of the adhesive; sufficient to solidify a remaining thickness of the adhesive
Data Source
AI summary
Methods and apparatuses for adhering optoelectronic components in optical, electronic or optoelectronic devices are disclosed. A UV-active adhesive is applied to an alignment sensitive component of the device. A first, relatively low dose of UV radiation sufficient to solidify an outer layer of the adhesive is applied to the adhesive. A second, relatively high dose of UV radiation sufficient to solidify the remaining thickness of the adhesive is then applied. The methods and apparatuses of the present invention advantageously reduce or eliminate changes in the position of a component during the adhesive curing process. The present method and apparatus allow for shorter total time for solidifying the adhesive, provide stable positioning during the adhesive solidification process, and enable increased manufacturing output and decreased waste.