UV Light-Emitting Device Adhesive Layout for UV Degradation Resistance
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Solution Overview
Problem
Resin adhesives used in light-emitting devices degrade when exposed to ultraviolet light emitted by semiconductor light-emitting elements, leading to potential failures and reduced productivity.
Innovation Solution
A light-emitting device design where a semiconductor light-emitting element is mounted on a first substrate, which is then mounted on a second substrate, with an optical member adhered using a resin adhesive on the second substrate's surface, minimizing exposure to ultraviolet light and incorporating an ultraviolet absorber in the adhesive to enhance resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If resin adhesive is used to fix optical members, then productivity is improved and ease of manufacture is enhanced, but the adhesive degrades due to ultraviolet light exposure
Solution Approach 1:
A resin layer is introduced as an intermediary substance between the optical member and the substrate. This resin layer serves as a mediator that protects the adhesive from direct ultraviolet light exposure while maintaining the bonding function, thereby resolving the contradiction between ease of manufacture and reliability
Solution Approach 2:
The adhesive is extracted from direct exposure to ultraviolet light by positioning it beneath the optical member and optical axis, where it is shielded from the harmful radiation. This separation of the adhesive from the ultraviolet light path allows the use of resin adhesive without degradation
2Productivity
If resin adhesive is used to adhere optical member, then productivity is improved, but degradation of adhesive occurs due to ultraviolet light
Solution Approach 1:
The resin layer acts as a protective intermediary that extends the service life of the adhesive by blocking ultraviolet light, thereby maintaining both high productivity and long duration of action
Solution Approach 2:
The optical member and resin layer are positioned in advance to shield the adhesive from ultraviolet light exposure before degradation can occur, providing prior protection that ensures long-term durability while maintaining manufacturing efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the degradation of the resin adhesive, improving the longevity and reliability of the light-emitting device while maintaining ease of assembly and productivity.
Implementation Method 1
incorporating an ultraviolet absorber in the adhesive to enhance resistance
Data Source
AI summary
A light-emitting device 1 includes a semiconductor light-emitting element 2 emitting ultraviolet light, a first substrate 5 on which the semiconductor light-emitting element 2 is mounted, a second substrate 6 which is arranged on a side of the first substrate 5 opposite to the semiconductor light-emitting element 2 and on which the first substrate 5 is mounted, and an optical member 7 adhered using a resin adhesive 8 to a surface 61 of the second substrate 6 on the first substrate 5 side.