UV-Sensitive Adhesive Composite Tape for Semiconductor EMI Shielding
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Solution Overview
Problem
Current EMI shielding processes for semiconductor packages are inefficient and low in productivity, as they are typically performed on a unit-by-unit basis.
Innovation Solution
A method involving attaching a substrate with electronic components to a UV-sensitive adhesive composite tape and a UV-transparent base film, singulating the substrate, depositing a shielding material, and using UV irradiation to reduce adhesive adhesivity for mass production of semiconductor devices with integrated shielding layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If EMI shielding is performed on semiconductor packages on a unit-by-unit basis, then the shielding quality can be maintained, but the productivity is relatively low
Solution Approach 1:
Multiple semiconductor packages are attached to a single substrate and processed simultaneously as one unit. The shielding material is deposited on the entire substrate at once, merging multiple individual shielding operations into a single batch process, thereby improving productivity while maintaining shielding quality.
Solution Approach 2:
Multiple semiconductor packages are pre-attached to a substrate before the shielding process. This preliminary arrangement allows subsequent shielding deposition to be performed on all packages simultaneously, eliminating the need for sequential unit-by-unit processing and significantly enhancing productivity.
2Productivity
If a UV-sensitive adhesive layer with UV-transparent base film is used, then productivity is improved through batch processing, but the adhesive layer requires UV irradiation to reduce adhesivity for detachment
Solution Approach 1:
The mechanical or thermal methods traditionally used to detach packages are replaced with UV optical irradiation. The UV-sensitive adhesive layer responds to UV light by reducing adhesivity, allowing non-contact, precise, and controlled detachment of packages from the substrate without mechanical force or heat.
Solution Approach 2:
The adhesive properties of the adhesive layer are changed by altering the UV irradiation parameter. By controlling the UV light exposure, the adhesivity is dynamically adjusted from high (during processing) to low (for detachment), enabling precise control over the bonding and release process.
3Productivity
If shielding material is deposited on the substrate before singulation, then simultaneous shielding of multiple devices is achieved, but the shielding material must be precisely deposited only on active areas
Solution Approach 1:
The shielding material deposition is applied selectively to specific regions of the substrate corresponding to the active areas of semiconductor packages. By controlling the deposition process to target only the necessary locations, precise shielding is achieved without wasting material on inactive areas, maintaining manufacturing precision while enabling batch processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances productivity by allowing for simultaneous shielding of multiple semiconductor devices, reducing adhesivity for easy detachment, and preventing metal burrs, thus improving the efficiency and quality of EMI shielding.
Implementation Method 1
irradiating a UV light to the composite tape through the UV-transparent carrier to reduce adhesivity of the adhesive layer
Implementation Method 2
depositing a shielding material on the plurality of semiconductor devices to form a shielding layer on each of the plurality of semiconductor devices
Data Source
AI summary
A method for making semiconductor devices includes: attaching a substrate with a plurality of electronic components onto a composite tape having an adhesive layer which is sensitive to ultraviolet (UV) irradiation and a UV-transparent base film, wherein the substrate is attached onto the adhesive layer of the composite tape; placing the substrate and the composite tape on a UV-transparent carrier, wherein the UV-transparent carrier is in contact with the UV-transparent base film of the composite tape; singulating the substrate into a plurality of semiconductor devices each having one of the plurality of electronic components; depositing a shielding material on the plurality of semiconductor devices to form a shielding layer on each of the plurality of semiconductor devices; irradiating a UV light to the composite tape through the UV-transparent carrier to reduce adhesivity of the adhesive layer; and detaching the plurality of semiconductor devices from the UV-transparent carrier.