UV Curable Conductive Agent for Module Bonding
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Solution Overview
Problem
Current Anisotropic Conductive Films (ACF) require complex equipment, high temperature, and high pressure for bonding, leading to short shelf life, material wastage, and unstable bonding accuracy due to thermal expansion, and are difficult to handle in large web forms.
Innovation Solution
A conductive agent comprising a liquid ultraviolet curable adhesive and conductive particles, where each particle is a plastic ball with a nickel and gold layer, dispersed at specific densities, is used for module bonding, cured with UV rays and pressure, allowing for room temperature application and reduced thermal expansion issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If traditional ACF bonding is used, then bonding strength is achieved, but equipment complexity and process difficulty increase
Solution Approach 1:
The patent replaces the traditional mechanical heating and pressing system with a UV light curing system. Instead of using complex equipment to generate high temperature and high pressure, the invention uses UV irradiation to activate the adhesive and achieve bonding, significantly simplifying the equipment requirements while maintaining bonding strength
Solution Approach 2:
The patent changes the curing parameter from thermal (temperature-based) to photonic (light-based). The adhesive is designed to cure under UV light irradiation rather than requiring high temperature, fundamentally changing the activation method and enabling simpler equipment to achieve the same bonding effect
2Strength
If high temperature bonding is applied, then bonding strength is improved, but thermal expansion and material wastage increase
Solution Approach 1:
The patent substitutes thermal energy with light energy for the bonding process. By using UV irradiation instead of high temperature heating, the invention eliminates thermal expansion issues and associated material wastage while maintaining effective bonding strength through photochemical curing of the adhesive
3Quantity of substance
If conventional ACF storage and handling is used, then material availability is maintained, but shelf life decreases and material wastage increases
Solution Approach 1:
The patent changes the storage condition parameter from temperature-sensitive to light-stable. The UV-curable adhesive can be stored at room temperature in its uncured state, and only activates when exposed to UV light during the bonding process. This eliminates the need for complex storage conditions and extends shelf life while preventing premature activation and material wastage
4Manufacturing precision
If high pressure bonding is used, then bonding accuracy is improved, but equipment complexity and energy consumption increase
Solution Approach 1:
The patent replaces the high-pressure mechanical bonding system with a UV light curing system. The UV irradiation activates the adhesive to bond components together without requiring sustained high pressure, thereby reducing energy consumption while maintaining bonding accuracy through precise light delivery and adhesive formulation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the bonding process, reduces material wastage, improves equipment utilization, and maintains bonding accuracy at lower temperatures, extending the shelf life of the conductive agent and enhancing production efficiency.
Implementation Method 1
a liquid ultraviolet curable adhesive and conductive particles dispersed in the ultraviolet curable adhesive
Data Source
AI summary
The present disclosure provides a conductive agent and a module bonding method. In the method, a conductive agent is sprayed to a bonding region. The conductive agent comprising a liquid ultraviolet curable adhesive and conductive particles dispersed in the ultraviolet curable adhesive. A module layer is pre-pressed onto the bonding region with the conductive agent between the module layer and the bonding region. The conductive agent is cured by irradiating the conductive agent with ultraviolet rays and pressurizing the conductive agent, so that the module layer is electrically connected and bonded to the bonding region.