UV-Curable Adhesive Probe Tip for DUT Attachment
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Solution Overview
Problem
Test and measurement probes face challenges in securing connections to small, densely packed electronic devices with difficult-to-access test points, leading to potential damage from semi-permanent attachments and variability in signal fidelity.
Innovation Solution
The use of a non-conductive, UV-curable adhesive to secure probe tips to devices under test, providing a strong and easily removable connection that minimizes damage and maintains signal integrity, along with optional clips and adhesive tapes for enhanced stability and ease of removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder-down probes are used to attach to DUT test points, then reliable electrical connection is achieved, but the risk of damage to DUT and probe increases due to poor accessibility and small gauge wires
Solution Approach 1:
The patent replaces the mechanical soldering process with a UV-curable adhesive bonding system. The adhesive is applied to the probe tip and cured using UV light to create a mechanical bond with the DUT surface, eliminating the need for solder wires and soldering operations. This substitution reduces damage risk while maintaining connection reliability.
Solution Approach 2:
The patent changes the bonding mechanism from thermal-metallurgical (soldering) to photochemical-adhesive (UV-curable adhesive). The UV-curable adhesive transitions from liquid to solid state upon UV exposure, creating a strong bond without the heat and mechanical stress associated with soldering, thereby reducing damage risk to sensitive DUT components.
2Reliability
If soldering is used to attach probe wires to DUT test points, then electrical connection is established, but set-up time increases and dexterity requirements increase due to poor accessibility
Solution Approach 1:
The patent replaces the complex mechanical process of soldering small gauge wires with a simplified adhesive application and UV curing process. The adhesive can be applied directly to the probe tip in one step, and curing is achieved rapidly through UV light exposure, dramatically reducing set-up time compared to traditional soldering operations in hard-to-reach areas.
Solution Approach 2:
The UV-curable adhesive system is self-aligning and self-bonding. Once applied to the probe tip, the adhesive automatically bonds to the DUT surface upon UV exposure without requiring precise manual alignment or additional manipulation, reducing the dexterity requirements and time needed for proper attachment.
3Reliability
If solder connections are used to attach probes to DUT, then electrical connection is achieved, but signal fidelity variability increases at upper frequencies due to inconsistent connection quality
Solution Approach 1:
The patent changes the connection method from soldering to UV-curable adhesive bonding, which provides more consistent bond strength and electrical characteristics. The adhesive creates a uniform connection interface that maintains stable signal fidelity across upper frequencies, eliminating the variability associated with manual soldering quality differences.
Solution Approach 2:
By replacing the soldering process with UV-curable adhesive bonding, the system eliminates the human skill variability inherent in manual soldering. The adhesive application process is more repeatable and controllable, resulting in consistent connection quality and predictable signal fidelity performance at high frequencies.
4Reliability
If small gauge wires are used to attach probes to DUT test points, then electrical connection is achieved, but the risk of damage to DUT increases during the soldering process
Solution Approach 1:
The patent eliminates the use of small gauge wires entirely by using a probe tip with integrated adhesive application surface. The UV-curable adhesive is applied directly to the probe tip and bonds to the DUT surface, creating a wireless connection that removes the risk of wire-related damage during both application and operation.
Solution Approach 2:
The patent changes from using thin, fragile wires to a solid probe tip with adhesive bonding. This parameter change eliminates the mechanical vulnerability of small gauge wires during the attachment process, reducing damage risk to the DUT while maintaining reliable electrical connection through the adhesive-bonded probe tip.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution offers a robust, reliable, and easily removable connection that reduces the risk of damage to the device or probe, while maintaining high signal fidelity and simplifying the attachment process, even in densely packed electronic environments.
Implementation Method 1
a non-conductive, UV-curable adhesive to secure probe tips to devices under test
Data Source
AI summary
A method of securing a probe tip to a device under test (DUT), the method comprising: positioning the probe tip near a test point of the DUT, the probe tip comprising a connection point on a signal-path portion of the probe tip and an attachment tab, the connection point making an electrical connection with the test point of the DUT, the attachment tab extending away from the signal-path portion of the probe tip; applying an adhesive to the DUT through a hole in the attachment tab of the probe tip; and curing the adhesive to secure the probe tip to the DUT.