UV-Curable Pressure-Sensitive Adhesive Tape for Residue-Free Component Cutting
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Solution Overview
Problem
Existing pressure-sensitive adhesive tapes used in component cutting processes have insufficient adhesive strength, leading to difficulties in peeling off the tape from cutting substrates and resulting in adhesive residue, limiting their application range.
Innovation Solution
A pressure-sensitive adhesive tape with a composition of 40-50 wt % acrylic resin, 40-65 wt % epoxy monomer, 0.05-0.5 wt % hardener, and 0.5-1.0 wt % initiator, which undergoes a crosslinking reaction upon UV exposure, reducing adhesive strength and facilitating easy removal without residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If UV adhesive layer uses only acrylic resin, then the adhesive layer is simple in composition, but the adhesive strength is insufficient and causes adhesive residue
Solution Approach 1:
The adhesive layer uses a composite formulation combining acrylic resin (40-50 wt%) with epoxy monomer (40-65 wt%), hardener (0.05-0.5 wt%), and initiator (0.5-1.0 wt%). This composite material approach resolves the contradiction by providing both strong adhesion (through epoxy-acrylic crosslinking) and controlled peelability (through acid value changes), eliminating adhesive residue while maintaining compositional manageability.
Solution Approach 2:
The invention utilizes parameter changes in the adhesive layer's acid value before and after UV exposure. The acid value decreases from 5-20 mg KOH/g before exposure to 1-4 mg KOH/g after exposure, indicating chemical transformation that reduces adhesive strength. This parameter change enables the adhesive to maintain strength during bonding then peel easily after exposure, resolving the contradiction between strength and peelability.
2Strength
If adhesive strength is increased to prevent peeling, then bonding strength improves, but the tape becomes difficult to remove and leaves residue
Solution Approach 1:
The adhesive layer's properties are made dynamic through UV-induced chemical transformation. Before UV exposure, the adhesive layer has high bonding strength (first acid value 5-20 mg KOH/g). After UV exposure, the chemical structure changes, reducing adhesive strength (second acid value 1-4 mg KOH/g) and enabling easy peeling. This dynamic property change resolves the contradiction between strong bonding and easy removal.
Solution Approach 2:
The adhesive layer is prepared with preliminary components (acrylic resin, epoxy monomer, hardener, initiator) that will undergo transformation upon UV exposure. The formulation is designed in advance to ensure that after UV treatment, the acid value decreases sufficiently to enable easy peeling without residue. This preliminary preparation resolves the contradiction by pre-configuring the adhesive for both strong bonding and subsequent easy removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The tape achieves improved bonding strength with substrates before UV exposure and reduced adhesive strength after exposure, allowing for easy peeling off without residue, enhancing its suitability for various component cutting processes.
Implementation Method 1
the epoxy monomer in the adhesive layer undergoes a crosslinking reaction, and the adhesive layer is formed to be an exposed adhesive layer
Implementation Method 2
an initiator is a photoinitiator. a wavelength of the ultraviolet light is between 300 nm and 380 nm
Data Source
AI summary
A pressure-sensitive adhesive tape suitable for component cutting process is provided. The pressure-sensitive adhesive tape includes a release film layer, an adhesive layer, and a support base layer that are stacked in sequence. Based on the adhesive layer having a total weight percent of 100 wt %, the adhesive layer includes 40-50 wt % of an acrylic resin, 40-65 wt % of an epoxy monomer, 0.05-0.5 wt % of a hardener, and 0.5-1.0 wt % of an initiator. The adhesive layer has a first acid value before being exposed to an ultraviolet light, the adhesive layer has a second acid value after being exposed to the ultraviolet light, and the second acid value is smaller than the first acid value.