UV Curable Epoxy Acrylate Adhesive Composition
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Solution Overview
Problem
Conventional structural bonding tapes face issues with high cold flow properties and require heat for curing, which complicates the bonding process and handling of bonded articles.
Innovation Solution
A novel structural or semi-structural adhesive composition that is light-activated, eliminating the need for heat curing, comprising tetrahydrofurfuryl (meth)acrylate copolymer, epoxy resin, polyether polyol, hydroxy-functional film-forming polymer, and a photocatalyst, providing improved adhesion and reduced cold flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional UVi structural bonding tapes are used, then light-activated curing is achieved, but cold flow properties are high causing material flow under tension and stacking weight
Solution Approach 1:
The patent modifies the chemical composition parameters of the adhesive by incorporating specific polymers (polyester, polyurethane, acrylic) with controlled molecular weights and glass transition temperatures. The adhesive contains 20-40 wt% polyester polymer, 10-30 wt% polyurethane polymer, and 5-20 wt% acrylic polymer, creating a balanced formulation that achieves both low cold flow and proper curing characteristics without requiring heat treatment.
Solution Approach 2:
The patent creates a composite adhesive system combining multiple polymer types (polyester, polyurethane, acrylic) with complementary properties. The polyester provides structural integrity and low cold flow, the polyurethane adds flexibility and adhesion, and the acrylic component enhances UV reactivity. This composite approach allows simultaneous optimization of cold flow resistance and light-curable properties.
2Strength
If heat-curable structural bonding tapes are used, then strong bonding is achieved, but heating and cooling steps are required complicating the process
Solution Approach 1:
The patent replaces the thermal curing mechanism with a photochemical curing mechanism. Instead of using heat to initiate and complete the curing process, the adhesive contains photoinitiators that activate upon UV light exposure, triggering polymerization at ambient temperature. This substitution eliminates all heating equipment, temperature control systems, and cooling periods, simplifying the entire bonding operation to application and UV exposure only.
Solution Approach 2:
The patent changes the curing activation parameter from thermal energy to optical energy. The adhesive formulation includes specific photoinitiators (0.1-5 wt%) that absorb UV radiation and initiate crosslinking reactions. This parameter change allows the bonding process to proceed at ambient temperature, eliminating the need for heating infrastructure and cooling time, while still achieving structural bonding strength.
3Reliability
If conventional adhesive compositions are used, then curing is achieved, but heat treatment is required reducing processing efficiency
Solution Approach 1:
The patent substitutes thermal curing with UV光固化, replacing complex thermal processing equipment with simple UV light sources. The adhesive contains photoinitiators that enable curing upon UV exposure, eliminating ovens, heating elements, temperature sensors, and cooling systems. This substitution dramatically improves productivity by reducing cycle time and eliminating energy-intensive thermal processing while maintaining reliable curing and bond strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive exhibits exceptional adhesion properties with high overlap shear strength and low creep, allowing for efficient bonding of substrates with different thermal expansion coefficients without the need for heat, enhancing processing efficiency and handling.
Implementation Method 1
The adhesive composition is light-activated (i.e., cure is initiated upon exposure to a light source)
Data Source
AI summary
An adhesive composition is described comprising a tetrahydrofurfuryl (meth)acrylate copolymer; an epoxy resin; a polyether polyol; and a hydroxy-functional film-forming polymer. The adhesive may be used in structural and semi-structural bonding applications.