UV-Curable Organosilicon Coating With Low Outgassing and Viscosity

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Solution Overview

Problem

Existing ultraviolet light curable compositions, particularly those containing organopolysiloxanes or organosilanes, suffer from high outgassing properties at high temperatures, and there is a need for compositions with low viscosity and excellent workability for substrate application.

Innovation Solution

A composition comprising organopolysiloxanes or organosilanes with multiple cationically polymerizable functional groups, a compound that releases a basic substance upon heating, and a photoacid generating agent, which results in a cured product with low outgassing and excellent workability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If ultraviolet light curable compositions containing organopolysiloxanes or organosilanes are used, then chemical stability and heat resistance are improved, but outgassing increases at high temperatures

Engineering Contradiction:
Improvechemical stabilityVSAvoidoutgassing
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent removes harmful low molecular weight oligomers and unreacted monomers from the composition system through careful selection of reactive diluents and control of molecular weight, thereby eliminating the source of outgassing while maintaining the chemical stability and heat resistance of the organopolysiloxane-based system

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent creates a composite curable composition system combining organopolysiloxanes with specific epoxy compounds and cationic photoinitiators, where each component contributes specific properties: the organopolysiloxane provides heat resistance and chemical stability, while the epoxy compounds and controlled crosslinking structure reduce outgassing by forming a denser, more stable cured network

Inventive Principle:
Principle #40Composite materials

2Temperature

If organopolysiloxanes or organosilanes are used in curable compositions, then heat resistance is improved, but viscosity increases reducing workability

Engineering Contradiction:
Improveheat resistanceVSAvoidworkability
Core Design Contradiction:
TemperatureVSEase of operation

Solution Approach 1:

The patent changes the molecular weight parameters and structural parameters of the organopolysiloxane components, selecting specific viscosity ranges and molecular weight distributions that balance heat resistance with acceptable viscosity for coating applications, thereby improving workability without sacrificing thermal performance

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces reactive diluents and co-monomers as intermediary components that reduce the viscosity of the organopolysiloxane system during the uncured state, improving workability and applicability, while these intermediaries participate in the curing reaction to form a crosslinked network that maintains heat resistance in the cured state

Inventive Principle:
Principle #24Intermediary (Mediator)

3Productivity

If inkjet printing method is used for application, then productivity is improved, but material requirements become more stringent

Engineering Contradiction:
ImproveproductivityVSAvoidmaterial requirements
Core Design Contradiction:
ProductivityVSAdaptability or versatility

Solution Approach 1:

The patent adjusts the viscosity parameters of the curable composition to fall within the optimal range for inkjet printing deposition, and modifies the molecular structure parameters to ensure appropriate wettability and non-clogging properties, thereby enabling inkjet printing application while maintaining the desired material performance

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent develops a curable composition that serves multiple functions: it has the viscosity and flow properties needed for inkjet printing, the chemical composition required for UV curing, and the thermal stability for high-temperature application, thereby meeting diverse material requirements through a single multi-functional formulation

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves low outgassing and excellent workability, making it suitable for insulating materials in electronic devices, particularly as a coating layer or protective layer with improved mechanical properties and coatability.

Implementation Method 1

an ultraviolet light curable composition containing an organosilicon compound, and preferably an organosilane and/or an organopolysiloxane

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Implementation Method 2

a compound that releases a basic substance when heated at 60 to 200° C.

Methodology Applied
Scientific EffectThermal decomposition: Thermolysis

Data Source

PatentUS20260022202A1Uv-curable composition and use thereof
Publication Date: 2026.01.22 DOW TORAY CO LTD
  • US20260022202A1 patent drawing
  • US20260022202A1 patent drawing
  • US20260022202A1 patent drawing

AI summary

Provided is an ultraviolet light curable composition containing a silicon atom, which provides a product obtained by curing that has excellent mechanical properties and low outgassing properties, and which also has excellent workability when applied to a substrate. The ultraviolet light curable composition includes: (A) one or more organopolysiloxanes or organosilanes having, on average, more than one cationically polymerizable functional group per molecule; (B) a compound that releases a basic substance when heated at 60 to 200° C.; and (C) a photoacid generating agent. The composition is substantially free of organic solvent, and the viscosity of the entire composition, measured at 25° C. using an E-type viscometer, is 500 mPa·s or less.