UV-Curable Polysiloxane Resin for Low-Loss Optical Waveguides
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Solution Overview
Problem
Existing optical waveguide materials face challenges with high light absorption in the near-infrared region, poor heat resistance, and low productivity, particularly when exposed to high-temperature solder reflow and requiring complex processing like reactive ion etching.
Innovation Solution
A curable resin composition comprising a polysiloxane resin with (meth)acryloyl or styryl groups, a (meth)acrylic acid derivative with specific structures, and a radical polymerization initiator, offering low light absorption, high heat resistance, and excellent UV curability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If fluorinated polyimide is used as optical waveguide material, then light absorption in near-infrared region is reduced, but high-temperature baking is required causing cracking and reactive ion etching is needed reducing productivity
Solution Approach 1:
The patent changes the chemical composition parameters by incorporating fluorinated cyclic carbonate units with specific structures (Formulae 1-1 to 1-8) into the polyimide backbone, achieving low light absorption without requiring high-temperature baking or reactive ion etching processes
Solution Approach 2:
The patent creates a composite polyimide structure combining fluorinated cyclic carbonate units with diamine components, achieving a material that simultaneously provides low light absorption, good patternability by photolithography, and resistance to high-temperature solder reflow
2Ease of manufacture
If conventional organic/inorganic hybrid materials are used, then patternability by photolithography is achieved, but light absorption in near-infrared region is not sufficiently small
Solution Approach 1:
The patent modifies the material composition by introducing fluorinated cyclic carbonate units with specific molecular structures that reduce light absorption in the near-infrared region while maintaining photolithography patternability through the polyimide structure
3Productivity
If polymer materials are exposed to high-temperature solder reflow, then electrical connections are formed, but materials with insufficient heat resistance show poor reliability
Solution Approach 1:
The patent changes the thermal stability parameters by incorporating fluorinated cyclic carbonate units and selecting specific diamine components that provide high heat resistance, enabling the material to withstand lead-free solder reflow temperatures without degradation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves low light absorption, high heat resistance, and improved productivity through UV curability, suitable for optical waveguides and adhesives in opto-electric hybrid boards.
Implementation Method 1
a curable resin composition containing a polysiloxane resin having one or more reactive groups selected from the group consisting of a (meth)acryloyl group and a styryl group, a (meth)acrylic acid derivative, and a radical polymerization initiator
Data Source
AI summary
An object of the present invention is to provide a material that has small absorption (low light absorption loss) in the near-infrared region used in optical communication, has excellent heat resistance, and, in addition, can produce a cured article having excellent productivity (UV curability) and also to provide an optical waveguide and an optical adhesive made from the material. Specifically, provided is a curable resin composition containing components (A) to (C) as essential components: (A) a polysiloxane resin having one or more reactive groups selected from the group consisting of a (meth)acryloyl group and a styryl group; (B) a (meth)acrylic acid derivative having a structure represented by General Formula (1); and (C) a radical polymerization initiator.