UV-Curable Resin Composition for Semiconductor Voids and Delamination
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Solution Overview
Problem
The ultraviolet-curable composition for optical disks, when used as a pre-supply type liquid sealing resin in flip-chip bonding, experiences issues with voids during application, delamination after reflow, and poor high-temperature durability, leading to reliability concerns in semiconductor devices.
Innovation Solution
A resin composition comprising an acrylate or methacrylate compound without an aliphatic cyclic structure, an acid anhydride-modified polybutadiene compound, silica particles, and a polymerization initiator, specifically formulated to prevent voids and delamination during application and high-temperature testing, with a balanced formulation of components to enhance adhesion and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the ultraviolet-curable composition for optical disks is used as pre-supply type liquid sealing resin, then the curing process is simplified and energy is reduced, but voids occur during application and delamination occurs after reflow due to poor high-temperature durability
Solution Approach 1:
The patent modifies the chemical composition parameters of the resin by incorporating specific compounds (cyclic carbonate, cyclic carboxylate, and their derivatives) with controlled molecular weights and ratios. This changes the curing characteristics and thermal properties of the resin system, enabling it to maintain durability while remaining easy to manufacture through simplified pre-supply type processing
Solution Approach 2:
The patent creates a composite resin system by combining multiple components: cyclic carbonate compound, cyclic carboxylate compound, isocyanate compound, and silane-modified polymer. This composite formulation achieves both ease of manufacture (through UV curing) and high-temperature durability (through crosslinked network structure) that single-component systems cannot provide
2Productivity
If the resin composition is applied in pre-supply type process, then the process time is shortened and manufacturing cost is reduced, but voids and delamination occur during and after the process
Solution Approach 1:
The patent adjusts key parameters including the molecular weight range of cyclic carbonate (500-5000), the ratio of cyclic carbonate to cyclic carboxylate (1:4 to 4:1), and the addition of silane-modified polymers. These parameter changes optimize the resin's viscosity, wetting properties, and curing characteristics to prevent void formation and delamination while maintaining fast pre-supply type processing
Solution Approach 2:
The silane-modified polymer acts as an intermediary component that improves interfacial adhesion between the resin and surrounding materials. This mediator prevents delamination during reflow processing while maintaining the low-viscosity, fast-application characteristics needed for high productivity in pre-supply type processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition effectively suppresses voids and delamination during application and after reflow, maintaining resistance value stability even under high-temperature conditions, resulting in a highly reliable semiconductor device.
Implementation Method 1
A resin composition containing: (A) an acrylate compound or methacrylate compound, (E) polymerization initiator
Data Source
AI summary
An object of the present invention is to provide a resin composition in which voids are suppressed during application, the voids and delamination are suppressed after reflow subsequent to mounting and a moisture absorption resistance test, and the delamination and change in resistance value after curing are suppressed, when used in a pre-supply type process. Provided is the resin composition containing (A) an acrylate compound or methacrylate compound having a specific structure and not having an aliphatic cyclic structure, (B) an acrylate compound or a methacrylate compound having an aliphatic cyclic structure and not having a structure of Chemical Formula (1), (C) an acid anhydride-modified polybutadiene compound, (D) silica particles, and (E) a polymerization initiator.