UV-Curable Resin Composition Balancing Low Viscosity and Adhesion
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Solution Overview
Problem
Curable resin compositions with high viscosity components face handling difficulties, limiting their usable design range and application flexibility.
Innovation Solution
A curable resin composition containing a crosslinkable compound with a specific structure, a high viscosity oligomer, and a polymerization initiator, which maintains low viscosity while achieving properties like thermal degradation resistance, hardness, adhesion, and weather resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a high viscosity component is used in the curable resin composition, then the cured product achieves desired physical properties such as thermal degradation resistance, hardness, and adhesion, but the composition itself becomes difficult to handle due to high viscosity
Solution Approach 1:
The patent applies parameter changes by carefully controlling the viscosity of the oligomer component within specific ranges (100-10,000 mPa·s at 25°C or 100-1,000 mPa·s at 60°C) and setting specific compositional ratios between the crosslinkable compound and oligomer (1/10 to 10/1 by mass). This optimization of physical parameters enables the composition to maintain low viscosity for easy handling while the cured product achieves desired physical properties including thermal degradation resistance, hardness, and adhesion.
2Strength
If a high viscosity component is used to achieve desired properties, then the cured product performance is improved, but the design range and application flexibility of the composition are limited
Solution Approach 1:
The patent optimizes physical parameters including viscosity ranges and compositional ratios to enable wide application flexibility. By controlling the oligomer viscosity and composition ratio, the composition can be adapted to various applications including coatings, inks, adhesives, sealants, and molding materials, while maintaining desired strength and adhesion properties in the cured product.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a balanced viscosity and desired properties, suitable for various applications including coatings, inks, sealants, and molding materials.
Implementation Method 1
active energy ray-curable resin composition containing: a crosslinkable compound (A); an oligomer (B) having a viscosity at 25°C of 1000 mPa·s or higher or a viscosity at 60°C of 400 mPa·s or higher; and a polymerization initiator (C)
Data Source
AI summary
The present invention aims to provide a curable resin composition that can retain low viscosity and exhibit properties appropriate for application, even when the curable resin composition contains a high viscosity component. The present invention relates to an active energy ray-curable resin composition containing: a crosslinkable compound (A); an oligomer (B) having a viscosity at 25°C of 1000 mPa·s or higher or a viscosity at 60°C of 400 mPa·s or higher; and a polymerization initiator (C), the crosslinkable compound (A) being represented by the following formula (1): wherein Z is an n-valent linking group, with n being an integer of 2 or greater.