UV-Curable Sealant for Microelectronic Package Thermal Stress Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Legacy microelectronic packages with organic substrates experience warpage due to coefficient of thermal expansion (CTE) mismatch and high stress caused by solder-based sealants, which require high bonding temperatures.
Innovation Solution
The use of a UV-curable sealant instead of or in addition to solder-based sealants, allowing bonding at room temperature and decoupling the attachment of the integrated heat spreader from thermal stress conditions, enabling low or zero-stress states in package components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If solder-based sealants are used for bonding, then strong bonding strength is achieved, but high thermal stress and warpage occur due to CTE mismatch and high bonding temperature
Solution Approach 1:
The patent changes the bonding temperature parameter from high temperature (solder reflow) to room temperature (UV curing). The UV-curable sealant material is applied and then cured using UV light at room temperature, eliminating the high thermal stress and warpage caused by traditional solder-based sealants that require high bonding temperatures.
Solution Approach 2:
The patent replaces the thermal bonding mechanism (solder reflow requiring high temperature) with a photopolymerization mechanism (UV curing at room temperature). This substitution eliminates the need for high temperature processing while achieving strong bonding, thereby reducing thermal stress and CTE mismatch issues.
2Reliability
If solder-based sealants are used, then reliable sealing is achieved, but manufacturing throughput is reduced due to high bonding temperature requirements
Solution Approach 1:
The patent changes the curing parameter from thermal processing to photopolymerization. The UV-curable sealant material cures rapidly when exposed to UV light, significantly reducing the bonding time compared to solder reflow processes while maintaining sealing reliability.
3Strength
If high bonding temperature is used for solder-based sealants, then proper bonding is achieved, but package substrate warpage increases due to thermal stress
Solution Approach 1:
The patent changes the bonding temperature from high temperature to room temperature. The UV-curable sealant material achieves proper bonding strength at room temperature through photopolymerization, eliminating the thermal stress that causes package substrate warpage while maintaining bonding integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces thermal stress on microelectronic package components, maintains package substrate conditions during bonding, and increases manufacturing throughput by utilizing low-temperature bonding techniques and the speed of UV-cure processes.
Implementation Method 1
a sealant material between the package substrate and the IHS, wherein the sealant material is formed of a material that cures when exposed to ultraviolet (UV) wavelengths
Data Source
AI summary
Embodiments may relate to a microelectronic package that includes an integrated heat spreader (IHS) coupled with a package substrate. The microelectronic package may further include a sealant material between the package substrate and the IHS. The sealant material may be formed of a material that cures when exposed to ultraviolet (UV) wavelengths. Other embodiments may be described or claimed.