UV-Curable Silicone Adhesive for LED Optical Semiconductor
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Solution Overview
Problem
Current UV-curable silicone compositions for optical semiconductor devices face challenges such as flow during heat-curing, irregular phosphor dispersion, and complexity in manufacturing, leading to shape deformation and color deviation in LED applications.
Innovation Solution
A UV-curable adhesive silicone composition comprising organopolysiloxane and organohydrogenpolysiloxane units with a photoactive catalyst, maintaining a plastic solid or semi-solid state at room temperature, allowing for uniform phosphor dispersion and controlled curing with UV light, preventing flow during heat-curing and enabling stable, uniform resin layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a thermosetting silicone resin composition is used with a platinum-based catalyst added in advance, then the curing reaction proceeds from immediately after compounding, but the pot life becomes short and the composition flows during heat-curing causing shape deformation
Solution Approach 1:
The patent applies preliminary action by adding a reaction control agent (inhibitor) to the silicone resin composition before use. This inhibitor pre-emptively suppresses the curing reaction, allowing the composition to remain stable during storage and handling. When needed, the inhibition is removed (e.g., by heating or adding a catalyst), allowing rapid curing to proceed without flow deformation, thus achieving both fast curing and shape accuracy.
2Duration of action of stationary object
If a reaction control agent is added to secure pot life, then the composition stability improves, but the curing speed becomes slow and the composition flows during heat-curing
Solution Approach 1:
The patent applies dynamics by using a reaction control agent that can be dynamically adjusted or removed. The inhibitor provides slow curing and long pot life during storage, but when processing is needed, the inhibition is removed (through heating, catalyst addition, or other triggers), allowing the system to transition to fast curing mode, thus achieving both long pot life and fast curing speed at different stages.
3Ease of manufacture
If the phosphor is irregularly dispersed or unevenly concentrated in the covering resin layer, then the manufacturing process is simple, but color deviation occurs and uniform white light cannot be obtained
Solution Approach 1:
The patent applies parameter changes by modifying the viscosity parameters of the silicone resin composition to optimize phosphor dispersion. By controlling the viscosity within a specific range and using appropriate diluents, the composition achieves optimal flow characteristics that allow phosphor particles to distribute uniformly during application, while maintaining ease of manufacturing through simple mixing processes.
4Productivity
If a UV-curable adhesive silicone composition is used, then the curing speed and manufacturing efficiency improve, but the composition may flow during heat-curing and deform the shape
Solution Approach 1:
The patent applies mechanics substitution by replacing traditional thermal curing mechanisms with UV light curing. The UV-curable silicone resin composition uses photoinitiated polymerization instead of heat-driven curing, enabling rapid curing at room temperature or low temperatures. This substitution eliminates the flow and deformation problems associated with heat-curing while maintaining high manufacturing efficiency through fast UV curing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for maintaining the initial shape during curing, ensuring high thermal resistance and light transmittance, with uniform phosphor dispersion and improved manufacturing efficiency, reducing color deviation and enhancing the stability and flexibility of the resin cured layer.
Implementation Method 1
a photocurable organopolysiloxane composition containing (methylcyclopentadienyl)trimethyl platinum as a curing catalyst is disclosed. The (methylcyclopentadienyl)trimethyl platinum is activated only when light is irradiated thereon
Implementation Method 2
since a hydrosilylation reaction is used to cure, in many cases, a platinum-based catalyst is added in advance in a thermosetting silicone resin composition
Data Source
Figure 1
AI summary
The present invention is a UV-curable adhesive silicone composition includes: (A) an organopolysiloxane having a resin structure consisting of R1SiO3/2, R22SiO2/2, and R3aR4bSiO(4-a-b)/2 units, wherein R4 represents a vinyl group or an allyl group, wherein 5 to 300 R22SiO2/2 units are continuously repeated, (B) an organohydrogenpolysiloxane having a resin structure consisting of R1SiO3/2, R22SiO2/2, and R3cHdSiO(4-c-d)/2 units, wherein 5 to 300 R22SiO2/2 units are continuously repeated, and (C) a photoactive catalyst, wherein the UV-curable adhesive silicone composition is in a plastic solid state or a semi-solid state in an uncured state at room temperature. Thereby, there can be provided a UV-curable adhesive silicone composition that is in a plastic solid state or a semi-solid state in an uncured state at room temperature and therefore easy to handle, can uniformly disperse a phosphor and cover a surface of an LED chip, and can readily form a cured layer only on a necessary portion.