UV Cure Chamber Secondary Reflector Irradiance Uniformity
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Solution Overview
Problem
Conventional UV curing systems for semiconductor substrates suffer from inefficiencies in uniform irradiance distribution, leading to radiation loss outside the substrate boundaries and non-uniform film curing, which slows down the fabrication process.
Innovation Solution
The design of a UV cure chamber with a secondary reflector that redirects otherwise lost UV radiation onto the substrate, combined with asymmetric and elliptical/parabolic reflector configurations, ensures uniform irradiance patterns and increased light intensity on the substrate, utilizing Monte Carlo simulations for optimization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional UV curing systems are used, then the substrate can be cured, but the irradiance distribution is non-uniform and radiation is lost outside substrate boundaries
Solution Approach 1:
A secondary reflector is introduced as an intermediary component between the UV lamp and substrate. This reflector redirects UV radiation that would otherwise be lost outside the substrate boundaries back onto the substrate surface, improving both energy efficiency and irradiance uniformity
Solution Approach 2:
The patent employs asymmetric and elliptical/parabolic reflector configurations that utilize three-dimensional geometric shapes to redirect radiation from multiple angles. This dimensional approach creates a more uniform irradiance pattern across the substrate surface by distributing radiation from different spatial directions
2Productivity
If conventional UV curing systems are used, then the curing process can proceed, but the fabrication process is slowed down
Solution Approach 1:
The secondary reflector ensures that UV radiation continuously acts on the entire substrate surface without interruption or loss. By redirecting radiation that would otherwise be wasted, the system maintains continuous effective curing action across the whole substrate, reducing total curing time and increasing productivity
3Manufacturing precision
If asymmetric and elliptical/parabolic reflector configurations are used, then uniform irradiance patterns are achieved, but the device complexity increases
Solution Approach 1:
The patent deliberately employs asymmetric reflector configurations and elliptical/parabolic geometries to achieve uniform irradiance distribution. These non-symmetric shapes are specifically designed to redirect radiation from the UV lamp to create balanced illumination patterns across the substrate, transforming an inherently non-uniform radiation source into a uniform curing field
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances UV radiation distribution, reducing waste and achieving faster, more uniform curing of dielectric films on semiconductor substrates, thereby improving processing efficiency and throughput.
Implementation Method 1
a secondary reflector positioned between the primary reflector and the substrate support, the secondary reflector adapted to redirect ultraviolet radiation that would otherwise not contact the substrate towards the substrate
Implementation Method 2
an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support
Implementation Method 3
a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other
Implementation Method 4
one or more reflectors adapted to generate a flood pattern of ultraviolet radiation over the substrate that has complementary high and low intensity areas which combine to generate a substantially uniform irradiance pattern if rotated
Data Source
AI summary
Embodiments of the invention relate generally to an ultraviolet (UV) cure chamber for curing a dielectric material disposed on a substrate and to methods of curing dielectric materials using UV radiation. A substrate processing tool according to one embodiment comprises a body defining a substrate processing region; a substrate support adapted to support a substrate within the substrate processing region; an ultraviolet radiation lamp spaced apart from the substrate support, the lamp configured to transmit ultraviolet radiation to a substrate positioned on the substrate support; and a motor operatively coupled to rotate at least one of the ultraviolet radiation lamp or substrate support at least 180 degrees relative to each other. The substrate processing tool may further comprise one or more reflectors adapted to generate a flood pattern of ultraviolet radiation over the substrate that has complementary high and low intensity areas which combine to generate a substantially uniform irradiance pattern if rotated. Other embodiments are also disclosed.