UV-Cured Adhesive for Display Electrical Connections
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display devices face issues such as warpage defects, electrical shorts, and damage to polarization plates due to thermal expansion differences and high-temperature curing processes, particularly in narrow bezel and full HD displays.
Innovation Solution
An adhesive material for electrical connections using a base resin, ionic optical-curing agent, optical curing accelerant, and conductive particles of several to several tens nanometers, cured by UV light with diffusion properties to prevent electrical shorts and allow low-temperature curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional thermal pressing at high temperature (150-190°C) is used to bond drive IC to array substrate, then electrical connection is achieved, but warpage defects occur due to thermal expansion differences and polarization plate damage occurs
Solution Approach 1:
The patent changes the curing method from conventional thermal pressing (150-190°C) to UV irradiation curing, which occurs at lower temperatures. This parameter change in the curing process temperature eliminates thermal expansion differences between components, preventing warpage defects and polarization plate damage while maintaining reliable electrical connection through the anisotropic conductive film
Solution Approach 2:
The patent replaces the thermal field (heat-based curing) with an optical field (UV irradiation curing). This substitution eliminates the harmful thermal effects causing warpage and component damage while achieving the same bonding function through UV-induced curing of the anisotropic conductive film at lower temperatures
2Reliability
If conventional thermal pressing is used for bonding, then electrical connection is established, but electrical shorts may occur between adjacent pad electrodes
Solution Approach 1:
The patent changes the curing temperature parameter from high temperature (150-190°C) to low temperature (room temperature or slightly elevated), which prevents thermal migration of conductive particles and eliminates electrical shorts between adjacent pad electrodes while maintaining proper electrical connection through the anisotropic conductive film
3Object-affected harmful factors
If UV irradiation is used for curing adhesive material, then low-temperature curing is achieved preventing warpage, but UV light cannot penetrate through array substrate to reach adhesive layer on pad electrode
Solution Approach 1:
The patent introduces a UV-transparent window or transparent adhesive layer as an intermediary that allows UV light to penetrate through the array substrate and reach the adhesive layer on the pad electrode. This intermediary enables UV irradiation curing at low temperature while maintaining the structural integrity and electrical functionality of the display device
Solution Approach 2:
The patent changes the UV irradiation direction from front-incident (through the display surface) to back-incident (through the array substrate from the rear side). This dimensional change in irradiation direction enables UV light to reach the adhesive layer on the pad electrode, allowing low-temperature curing without causing warpage defects
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive material effectively prevents warpage defects and electrical shorts while maintaining electrical connectivity, and reduces thermal damage to components, enabling reliable and efficient assembly of display devices with improved ambient contrast ratios.
Implementation Method 1
an optical curing accelerant having a light diffusion property, wherein the adhesive film is cured by a UV light, and the UV light is diffused by the optical curing accelerant
Implementation Method 2
an ionic optical-curing agent... the adhesive film is cured by a UV light
Data Source
AI summary
The present invention provides an adhesive layer for an electrical connection. The adhesive layer includes a base resin; an ionic optical-curing agent; an optical curing accelerant; and a conductive particle having a size of several to several tens nanometers, wherein the adhesive layer is cured by a UV light, and the UV light is diffused by the optical curing accelerant.