UV-Cured CMP Pad Composition for Higher Planarization Productivity

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Solution Overview

Problem

There is a need for an improved chemical mechanical polishing (CMP) pad with higher planarization performance and productivity.

Innovation Solution

A CMP pad with a polishing layer formed by extruding a photopolymerizable composition comprising a block copolymer, a UV curable acrylate, and a photoinitiator, followed by UV curing, which results in a Shore D hardness of 40 to 70.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional CMP pads are used, then basic polishing function is provided, but planarization performance and productivity are insufficient

Engineering Contradiction:

Improveplanarization performance and productivityVSAvoidpolishing performance consistency

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent applies parameter changes by modifying the chemical composition of the polishing pad, specifically incorporating perfluorinated compounds and controlling the ratio of polyurethane polymer to crosslinking agent. This chemical parameter optimization enhances both the planarization performance and productivity while maintaining reliable polishing results.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials by combining polyurethane polymer with perfluorinated compounds and crosslinking agents to create a polishing pad with enhanced properties. This composite structure provides improved planarization performance and productivity while ensuring consistent polishing results.

Inventive Principle:

Principle #40Composite materials

2Strength

If photopolymerizable composition is extruded and UV cured, then Shore D hardness of 40 to 70 is achieved, but manufacturing complexity increases

Engineering Contradiction:

ImproveShore D hardnessVSAvoidmanufacturing process complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent replaces traditional mechanical curing methods with UV photopolymerization. The extruded photopolymerizable composition is cured using UV light, which is a more efficient and controllable process than conventional thermal or mechanical curing methods. This substitution achieves the desired Shore D hardness of 40 to 70 while actually simplifying the manufacturing process through faster curing times and better process control.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The CMP pad achieves enhanced planarization performance and productivity, with improved mechanical properties and polishing efficiency.

Implementation Method 1

A CMP pad with a polishing layer formed by extruding a photopolymerizable composition comprising a block copolymer, a UV curable acrylate, and a photoinitiator, followed by UV curing

Methodology Applied

Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS12220784B2Chemical mechanical polishing pad and preparation thereof

Publication Date: 2025.02.11 DUPONT ELECTRONIC MATERIALS HLDG INC

AI summary

The present invention concerns a chemical mechanical polishing pad having a polishing layer. The polishing layer contains an extruded sheet. The extruded sheet is a photopolymerizable composition containing a block copolymer, a UV curable acrylate, and a photoinitiator.