UV-Cured Mold Fabrication Preventing Thermal Deformation
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Solution Overview
Problem
The existing methods for fabricating molds for semiconductor integrated circuits and flat panel displays are complex and costly due to the need for precise patterning and handling, and the molds often deform due to thermal solidification processes, requiring additional steps to adjust surface energy and prevent deformation.
Innovation Solution
A method involving the formation of a photo-polymerizable resin layer between a master substrate and a transparent mold substrate, where the resin layer is solidified using UV light to create a mold with a desired surface pattern and energy characteristic, preventing deformation by double UV exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If thermal solidification is used to form the mold, then the resin layer can be solidified, but the mold deforms due to solvent release
Solution Approach 1:
The patent changes the solidification method from thermal to photo-polymerization by UV light exposure. This parameter change prevents mold deformation because photo-polymerization occurs at lower temperatures and does not cause the same solvent release and molecular chain movement that occurs with thermal curing, thereby maintaining both shape stability and precision
Solution Approach 2:
The patent replaces the thermal field (heat-based solidification) with a photo field (UV light-based polymerization). This substitution eliminates the harmful thermal effects that cause mold deformation while achieving the desired solidification, resolving the contradiction between stability and precision
2Adaptability or versatility
If additional handling steps are performed to reform the surface using SAMS, then the surface energy can be adjusted, but the fabricating method becomes more complex
Solution Approach 1:
The patent combines the solidification process and surface energy adjustment into a single photo-polymerization step. By controlling UV light exposure parameters, both the structural formation and surface characteristics are simultaneously determined, eliminating the need for separate SAMS treatment steps and reducing overall process complexity
Solution Approach 2:
The patent performs surface energy adjustment during the initial mold fabrication process rather than as a subsequent step. The photo-polymerization process inherently determines the surface properties, so the desired surface energy is established beforehand, eliminating the need for additional handling steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the mold fabrication process, prevents deformation, and allows for precise control of surface energy, reducing costs and improving yield rates by eliminating the need for additional handling steps and thermal solidification.
Implementation Method 1
solidifying the resin layer by exposing the resin layer to a UV light through the transparent mold substrate
Data Source
AI summary
A method for fabricating a mold includes the steps of forming a photo-polymerizable resin layer between a master substrate and a transparent mold substrate, wherein a first pattern is formed on the master substrate; solidifying the resin layer by exposing the resin layer to a UV light through the transparent mold substrate; and forming a mold having a second pattern by separating the resin layer from the master substrate, wherein the second pattern is in a form of a recess on the resin layer at a portion corresponding to the first pattern and the resin layer being engaged with the mold substrate.