UV-Cured Pad Bonding for Electronic Component Mounting
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Solution Overview
Problem
The existing methods for manufacturing electronic devices with mounted electronic components on circuit substrates have low productivity due to inefficient soldering processes, particularly in mass production scenarios.
Innovation Solution
The use of optical firing paste, which is cured by ultraviolet light, to electrically and mechanically connect terminal electrodes on electronic components with pads on circuit substrates, improving manufacturing efficiency through the formation of holes for light transmission and photocuring processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder paste printing and reflow soldering are performed to mount electronic components on circuit substrates, then reliable electrical and mechanical connections are achieved, but production throughput is low
Solution Approach 1:
The patent replaces the thermal-based soldering process with a photocuring process. Optical firing paste containing photocurable resin is applied to pads, electronic components are mounted, and UV light irradiation cures the paste to form conductive adhesive bonds. This substitutes the mechanical/thermal soldering system with an optical-chemical curing system, enabling faster processing and improved throughput while maintaining connection reliability.
Solution Approach 2:
The patent changes the fundamental parameter of the bonding process from thermal (soldering temperature and time) to optical (UV light wavelength and intensity). By using photocurable resin that cures upon UV irradiation, the process parameters shift from high-temperature thermal fields to controlled optical fields, enabling rapid curing and high-speed production while ensuring reliable electrical and mechanical connections.
2Manufacturing precision
If holes for light transmission are formed in pads and terminal electrodes, then optical firing paste can be effectively cured, but manufacturing complexity increases
Solution Approach 1:
The patent applies optical firing paste to pads before mounting electronic components. This preliminary application allows the paste to be in position and ready for curing, and the subsequent formation of holes for light transmission occurs in a controlled sequence. The preliminary action of paste application simplifies the overall process by establishing the bonding material in place before structural modifications are made.
Solution Approach 2:
The optical firing paste acts as an intermediary material that bridges pads and terminal electrodes. It provides both electrical conductivity and mechanical adhesion while enabling optical curing. The paste formulation includes conductive fillers and photocurable resin, serving as a multi-functional mediator that simplifies the interface between electrical and optical domains in the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the manufacturing efficiency of electronic devices by ensuring strong and reliable connections between terminal electrodes and pads, thereby improving the overall production throughput.
Implementation Method 1
a cured product of optical firing paste obtained by receiving light from a second surface that is a surface opposite to the first surface of the circuit substrate
Data Source
AI summary
An electronic device is provided with an electronic component having a base material and a terminal electrode formed on a first surface of the base material, and a circuit substrate in which a pad for mounting the electronic component is formed on a first surface. A hole for light transmission is formed in the pad, and the pad and the terminal electrode are electrically and mechanically connected to each other with a cured product of optical firing paste obtained by receiving light from a second surface that is a surface opposite to the first surface of the circuit substrate.