UV-Cured Polymer Molds Using Transparent Thermoplastic Walls

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Solution Overview

Problem

The traditional curing process of polymers in molds is costly and time-consuming, requiring expensive molds that are inflexible and subject to thermal stress, limiting production flexibility and increasing costs due to high material and development expenses.

Innovation Solution

A method using UV-transparent thermoplastic polymer molds with thin, flexible walls and UV semiconductor light sources to cure UV-curable polymer compounds, allowing for efficient and controlled curing with reduced heat generation and mold complexity, enabling faster production and lower costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional heated steel molds are used for polymer curing, then the polymer structure can be shaped and cured, but the mold costs are very high and the process is time-consuming

Engineering Contradiction:
Improvecuring qualityVSAvoidcuring time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent replaces the traditional thermal curing mechanism with UV light irradiation. Instead of using heated steel molds that rely on thermal conduction to cure polymers, the invention uses UV-transparent molds that allow UV light to pass through and cure the polymer compound directly, eliminating the need for high temperatures and long heating periods

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the curing parameter from thermal energy to UV light energy. By using UV curable polymer compounds and irradiating them with UV light through UV-transparent mold walls, the curing process is accelerated significantly compared to traditional thermal curing, reducing both time and energy consumption

Inventive Principle:
Principle #35Parameter changes

2Adaptability or versatility

If expensive steel molds are purchased for different sizes and shapes, then various polymer structures can be produced, but the investment costs increase significantly

Engineering Contradiction:
Improvemold flexibilityVSAvoidmold investment
Core Design Contradiction:
Adaptability or versatilityVSQuantity of substance

Solution Approach 1:

The patent employs UV-transparent mold walls made from cost-effective thermoplastic polymers that can be easily manufactured and replaced. These molds are much cheaper than traditional steel molds, making it economically feasible to have multiple molds for different product sizes and shapes, thereby increasing versatility without significant investment

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent changes the mold material from expensive, thermally conductive steel to affordable, UV-transparent thermoplastic polymers. This material substitution dramatically reduces mold costs while maintaining functionality, enabling manufacturers to invest in a variety of molds for different applications

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If UV-transparent thermoplastic polymer molds are used, then mold costs are reduced and flexibility is improved, but the molds must be UV transparent which limits material choices

Engineering Contradiction:
Improvemold costVSAvoidmold material options
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent identifies thermoplastic polymers that simultaneously provide UV transparency, moldability, and cost-effectiveness. Materials like PMMA (acrylic) and certain polyurethanes serve multiple functions: they are transparent to UV light, easy to manufacture into various shapes and sizes, and inexpensive compared to steel, thus resolving the limitation on material choices

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Reliability

If traditional UV light sources are used for curing, then polymer compounds can be cured, but heat generation is high and curing control is less precise

Engineering Contradiction:
Improvecuring effectivenessVSAvoidheat generation
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent replaces traditional high-heat UV light sources with UV LED technology. UV LEDs emit UV light with minimal thermal radiation, significantly reducing heat generation in the mold and polymer compound while maintaining effective curing. This substitution also enables more precise control of the curing process through electronic control of LED intensity and duration

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach shortens curing time, reduces mold costs, and allows for flexible mold designs, minimizing thermal stress and enabling the production of high-quality polymer structures with reduced material usage and faster development cycles, suitable for applications like high-voltage components.

Implementation Method 1

irradiating the polymer compound, through the at least one wall, by means of UV light provided by at least one UV semiconductor light source, wherein the irradiating comprises irradiating the at least one wall such that UV light passes through the polymer compound, thereby curing the polymer compound to form the cured polymer structure

Methodology Applied
Scientific EffectPhotopolymerisation: Photopolymerisation

Data Source

PatentUS9643344B2UV curing method and an assembly therefor
Publication Date: 2017.05.09 KUNGSORS PLAST AB
  • US9643344B2 patent drawing
  • US9643344B2 patent drawing
  • US9643344B2 patent drawing

AI summary

It is presented a method for producing a cured polymer structure from a polymer compound which is UV curable and partly UV transparent. The method comprises injecting the polymer compound into a mold (2), which mold (2) has at least one wall (7) defining a mold space (6) for receiving the polymer compound in the mold space (6). The at least one wall (7) of the mold (2) is UV transparent and comprises a thermoplastic polymer. The polymer compound is then irradiated through the at least one wall (7), by means of at least one UV semiconductor light source, thereby curing the polymer compound to form the cured polymer structure. An assembly for producing a polymer structure and a mold (2) is also presented herein.