UV-Cured RFID Medium for Heat-Sensitive Label Assembly
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Solution Overview
Problem
The application range of RFID media such as RFID labels and tags is limited due to the laminated structure and physical properties of the inlay base material, particularly when heat-sensitive color-developing layers are involved, necessitating a method to simplify the structure without applying heat.
Innovation Solution
An RFID medium with a base material having a thermosensitive color-developing layer on one surface and an antenna on the other, connected by a conductive material cured by ultraviolet light, allowing direct mounting of the antenna and IC chip without a heating process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a thermosensitive color-developing layer is used on the base material, then printing functionality is improved, but heat resistance deteriorates
Solution Approach 1:
The patent divides the RFID medium into distinct functional layers: the base material with thermosensitive color-developing layer for printing, and a separate RFID inlay containing the antenna and IC chip. This segmentation allows each component to be optimized independently - the base material can be heat-sensitive for printing while the RFID inlay is designed to withstand thermal processes during manufacturing.
Solution Approach 2:
The patent applies preliminary action by pre-manufacturing the RFID inlay with the antenna and IC chip before attaching it to the base material. This allows the RFID components to be assembled and tested separately, then integrated onto the heat-sensitive base material without exposing the entire assembly to heat during the RFID manufacturing process.
2Temperature
If an RFID inlay is pre-manufactured and laminated, then heat protection is improved, but device complexity increases
Solution Approach 1:
The patent segments the RFID medium into a base material layer and an RFID inlay layer that can be independently manufactured and then laminated together. This segmentation provides heat protection for the thermosensitive color-developing layer while maintaining manageable complexity through modular assembly rather than requiring a completely integrated structure.
3Device complexity
If the antenna and IC chip are directly formed on the base material, then device complexity is reduced, but heat damage risk increases
Solution Approach 1:
The patent applies preliminary action by pre-assembling the antenna and IC chip into a separate RFID inlay before attaching it to the base material. This allows the RFID components to be formed and connected in a controlled environment, then the entire inlay is attached to the heat-sensitive base material without exposing the base material to high temperatures during the RFID assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This simplifies the structure of the RFID medium by eliminating the need for pre-manufactured RFID inlays, ensuring the base material with a thermosensitive layer is not exposed to heat, and facilitates easy separation and handling of the labels or tags.
Implementation Method 1
the antenna and the IC chip are connected to each other by a conductive material that is cured by ultraviolet light
Implementation Method 2
a thermosensitive color-developing layer that develops color by heat
Data Source
AI summary
An RFID medium including: a base material, a thermosensitive color-developing layer formed on a front surface of the base material and developed a color by heat, an antenna formed on a rear surface of the base material, and an IC chip connected to the antenna, in which the antenna and the IC chip are connected to each other by a conductive material that is cured by an ultraviolet ray.