UV Curing Display Stack Adhesive Warping
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Solution Overview
Problem
The curing process for electronic display stacks can result in substrate warping and decreased adhesion due to exposure to high temperatures and limited adhesive curing, affecting the quality of the display and user satisfaction.
Innovation Solution
A method where a first adhesive is partially cured using UV radiation before coupling a third substrate with a second adhesive, reducing energy consumption and exposure to high temperatures, and improving adhesion strength by allowing increased UV exposure and preventing UV blocking materials from interfering with the curing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is fully cured using traditional high-temperature processes, then adhesion strength is improved, but substrate warping occurs and manufacturing precision deteriorates
Solution Approach 1:
The patent changes the curing parameters from high-temperature conventional curing to UV light curing at lower temperatures. This parameter change allows the adhesive to achieve sufficient curing strength without exposing substrates to high temperatures that cause warping, thereby resolving the contradiction between adhesion strength and substrate flatness.
Solution Approach 2:
The patent replaces thermal curing (heat-based mechanism) with UV light curing (optical-based mechanism). This substitution eliminates the thermal effects that cause substrate warping while maintaining effective adhesive curing, thus improving manufacturing precision without sacrificing adhesion strength.
2Manufacturing precision
If adhesive is partially cured with UV radiation before stacking, then substrate warping is reduced, but adhesion strength may be insufficient
Solution Approach 1:
The patent applies preliminary UV curing to the adhesive before stacking substrates. This preliminary action partially cures the adhesive, providing initial bond strength while allowing subsequent curing steps to achieve full adhesion strength, thus resolving the contradiction between preventing warping and ensuring sufficient bonding.
Solution Approach 2:
The patent segments the curing process into multiple stages: preliminary UV curing before stacking, and additional UV curing after stacking. This segmentation allows the adhesive to be cured in controlled portions, achieving both warping prevention and sufficient adhesion strength through progressive curing.
3Object-affected harmful factors
If UV blocking materials are present during adhesive curing, then substrate protection is improved, but adhesive curing is limited and energy efficiency decreases
Solution Approach 1:
The patent segments the curing process timing relative to substrate assembly. By performing preliminary UV curing before stacking substrates with UV-blocking materials, the adhesive receives full UV energy exposure without interference. This segmentation allows both complete adhesive curing (energy efficiency) and substrate protection (when blockers are present) to be achieved at different stages.
Solution Approach 2:
The patent performs UV curing as a preliminary action before assembling substrates that contain UV-blocking materials. This preliminary curing ensures the adhesive receives adequate UV energy before the blocking materials are introduced, thus maintaining curing energy efficiency while still providing substrate protection in subsequent stages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces substrate warping and improves adhesion strength, leading to enhanced display quality and user satisfaction by optimizing the curing process for electronic display stacks.
Implementation Method 1
A first adhesive coupling a first substrate of a display stack with a second substrate of the display stack can be subjected to a curing operation before coupling a third substrate to the second substrate with a second adhesive
Data Source
AI summary
In some implementations, a process includes forming a layer of a liquid optically clear adhesive (LOCA) on a surface of a first substrate. Additionally, the LOCA can be contacted with a surface of a second substrate. The LOCA can then be exposed to Ultraviolet (UV) radiation. After exposing the LOCA to UV radiation, additional substrates can be coupled to the first substrate, the second substrate, or both to form a display stack. In an implementation, the total energy/unit area for the UV radiation applied to the LOCA can be no greater than 25,000 kJ/cm2.