UV Curing Apparatus Light Shading Kit Sealing Ring Protection
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Solution Overview
Problem
During UV curing of low-k dielectric films, maintaining uniform UV curing intensity across the wafer surface is challenging, leading to film shrinkage and variability in device performance, and existing solutions fail to adequately protect sealing rings from UV damage, causing defects.
Innovation Solution
A UV curing apparatus with a light shading kit made of UV-resistant materials, such as aluminum or aluminum alloy, is used to shield the sealing ring from direct UV exposure, while allowing UV radiation to reach the wafer, and a rotary mechanism ensures uniform exposure of the wafer to UV light.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If UV light is applied to cure the dielectric film, then the film's mechanical strength and low-k properties are improved, but the sealing ring is damaged by UV exposure
Solution Approach 1:
A light shading kit is introduced as an intermediary component between the UV light source and the sealing ring. This shading kit selectively blocks UV radiation from reaching the sealing ring while allowing the dielectric film to receive adequate UV exposure for curing, thus protecting the sealing ring without compromising the film's mechanical strength improvement
Solution Approach 2:
The shading kit is positioned to provide localized UV protection specifically to the sealing ring area, while leaving other regions (where the dielectric film is cured) unaffected. This localized approach ensures that the sealing ring is protected from UV damage while the film still receives sufficient UV irradiation to improve its mechanical properties
2Strength
If UV curing is performed to improve film properties, then elastic modulus and hardness increase, but non-uniform curing causes film shrinkage and device performance variability
Solution Approach 1:
The system employs a rotatable wafer holder that dynamically rotates the wafer during UV curing, ensuring uniform exposure of different wafer regions to UV light. This dynamic rotation prevents localized over-curing or under-curing, maintaining consistent film properties and preventing shrinkage across the entire wafer surface
Solution Approach 2:
The wafer holder performs periodic rotation during the UV curing process, creating a cyclic exposure pattern that ensures all regions of the dielectric film receive equivalent UV dosage over time. This periodic action promotes uniform curing throughout the film, preventing shrinkage and ensuring consistent mechanical properties across the wafer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures uniform UV curing intensity across the wafer surface, preventing film shrinkage and sealing ring damage, thereby improving device performance and extending the apparatus' lifespan.
Implementation Method 1
UV light source (130) including a UV lamp unit (132) for emitting UV wavelength radiation
Implementation Method 2
curing the dielectric film on the surface of the wafer
Implementation Method 3
The reflectors (138, 190) can be made of aluminum or aluminum alloy, and the surfaces of the first reflector (138) and the second reflector (190) are treated by surface treatment, such as by an aluminum anodization process
Implementation Method 4
anodization process
Implementation Method 5
A UV transparent window such as quartz window (140) is positioned and seated above the wafer (200) to allow UV wavelength radiation from the lamp unit (132) to pass through the quartz window (140) and irradiate the wafer (200)
Implementation Method 6
A light shading kit (210) is disposed between the UV light source (130) and the sealing ring (180) to prevent the sealing ring (180) from being damaged by being exposed of the UV light
Data Source
AI summary
A UV curing apparatus includes a processing chamber, a UV light source disposed above the processing chamber, a window disposed between the processing chamber and the UV light source for allowing a UV light from the UV light source passing through and entering the processing chamber, a sealing ring disposed between the processing chamber and the window for sealing the processing chamber, and a light shading kit disposed between the UV light source and the sealing ring for preventing the sealing ring from being exposed of the UV light. Therefore the sealing ring is not exposed of UV light directly, and the bonding of the rubber sealing ring would not be destroyed.