UV Curing Resin Bonding for Thermal Expansion Position Deviation
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Solution Overview
Problem
Existing bonding methods face challenges in achieving high position accuracy due to thermal expansion and position deviations during the bonding of two articles, particularly when heated, leading to inaccuracies in alignment and bonding.
Innovation Solution
A bonding method and device that involves positioning and fixing one bonded article relative to another using ultraviolet curing resin, where the resin is cured before heating, to minimize position deviations caused by thermal expansion, and includes steps for measuring and correcting position deviations to ensure accurate alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If two bonded articles are bonded by pressurizing while heating, then bonding strength is improved, but position deviation occurs due to thermal expansion
Solution Approach 1:
The patent applies preliminary positioning and UV curing before heating to establish a stable reference frame. The resin portion is cured at a predetermined temperature (room temperature or slightly elevated) to fix the relative positions of the bonded articles before thermal expansion occurs during subsequent heating for bonding. This preliminary action prevents position deviation that would otherwise occur during thermal expansion.
Solution Approach 2:
The patent changes the temperature parameter dynamically - first maintaining a predetermined temperature for positioning and UV curing to ensure high position accuracy, then increasing temperature for heating and bonding. This parameter change allows the system to achieve both high position accuracy (at lower temperature) and strong bonding (at higher temperature) without the position deviation that would occur if heating were applied continuously.
2Manufacturing precision
If positioning is performed before heating, then position accuracy is improved, but thermal expansion during bonding causes position deviation
Solution Approach 1:
The patent performs preliminary positioning and UV curing at a predetermined temperature to establish a stable reference frame before heating. The cured resin portion acts as a rigid connector that maintains the relative positions of the bonded articles even when heated, ensuring position stability throughout the bonding process.
Solution Approach 2:
The resin portion serves as an intermediary element that connects the first and second bonded articles. By curing this intermediary at a predetermined temperature before heating, the patent creates a stable reference frame that resists thermal expansion, thereby maintaining position stability during subsequent heating and bonding operations.
3Strength
If UV curing is performed after heating, then bonding strength is improved, but position deviation occurs due to thermal expansion
Solution Approach 1:
The patent performs UV curing as a preliminary action before heating, not after. This timing ensures that the resin portion cures at a predetermined temperature while the bonded articles are still at their initial positions, preventing thermal expansion-induced position deviation. The subsequent heating then strengthens the bonding without causing position deviation since the reference frame is already established.
Solution Approach 2:
The patent employs periodic action by separating the UV curing and heating processes into distinct stages: first UV curing at a predetermined temperature to establish position accuracy, then heating to improve bonding strength. This periodic separation of functions allows each process to optimize its specific goal without interfering with the other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for bonding with high position accuracy by pre-fixing the second bonded article to the first using ultraviolet curing resin, thereby reducing thermal expansion-induced deviations and ensuring precise alignment and bonding.
Implementation Method 1
a fixing step of fixing the second bonded article to the first bonded article by irradiating the resin portion with an ultraviolet ray and curing the resin portion
Implementation Method 2
a bonding step of bonding the second bonding portion of the second bonded article to the first bonding portion of the first bonded article by heating the first bonded article and the second bonded article
Implementation Method 3
a position deviation may occur due to thermal expansion of the two bonded articles
Data Source
AI summary
A bonding device measures a position deviation amount of the chip with respect to the substrate in a state where the chip and the substrate are in contact, and corrects and moves the chip relatively to the substrate in such a way as to reduce the position deviation amount, based on the measured position deviation amount. Then, the bonding device fixes the chip to the substrate by irradiating a resin portion of the chip with an ultraviolet ray and curing the resin portion when the position deviation amount of the chip with respect to the substrate is equal to or less than a position deviation amount threshold value.