UV Destaticizing Substrate Processing for Semiconductor Yield
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Substrates in semiconductor device manufacturing can become electrified due to frictional electrification during liquid processing, leading to yield reductions and potential electrostatic breakdown.
Innovation Solution
A substrate processing method involving ultraviolet (UV) irradiation with wavelengths of 200 nm or less before and after processing liquid supply steps to destaticize the substrate, using a substrate processing apparatus with pre-UV and post-UV irradiation units under nitrogen atmospheres to minimize damage and enhance polymer removal efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a processing liquid is supplied to a substrate during liquid processing, then cleaning and polymer removal are achieved, but the substrate becomes electrified due to frictional electrification, reducing product yield
Solution Approach 1:
The patent applies preliminary action by irradiating the substrate with UV rays before the liquid processing step to pre-destaticize the substrate. This preventive measure eliminates electrostatic charge before frictional electrification can occur during liquid processing, thereby maintaining both cleaning quality and product yield without contradiction
Solution Approach 2:
The patent converts the harmful effect of UV irradiation (potential damage to substrate) into a beneficial effect by using controlled UV irradiation at specific wavelengths (200 nm or less) to destaticize the substrate. The UV energy that could potentially damage the substrate is instead utilized to eliminate electrostatic charge, transforming a potential harm into the benefit of electrostatic elimination while maintaining substrate integrity
2Reliability
If UV rays with wavelength of 200 nm or less are used to destaticize the substrate, then electrostatic elimination is effective, but ozone generation may damage low-k films on the substrate
Solution Approach 1:
The patent applies parameter changes by precisely controlling the UV wavelength parameter (200 nm or less) and the atmospheric composition (nitrogen concentration 30% or more). By adjusting these parameters, the system achieves effective destaticizing while minimizing ozone generation that could damage low-k films
Solution Approach 2:
The patent uses an inert atmosphere (nitrogen-based atmosphere with 30% or more nitrogen concentration) during UV irradiation to suppress ozone generation. The nitrogen atmosphere replaces oxygen, preventing the formation of ozone molecules that would otherwise be generated by UV irradiation and cause damage to sensitive low-k films on the substrate
3Reliability
If UV irradiation is performed before and after liquid processing, then substrate destaticizing is enhanced, but processing time increases
Solution Approach 1:
The patent merges the UV irradiation steps with the liquid processing operation by performing UV irradiation before and after the liquid processing in an integrated manner. This combining of operations allows for enhanced destaticizing effectiveness while minimizing the total processing time by eliminating separate destaticizing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively destaticizes substrates before and after liquid processing, reducing yield losses and electrostatic damage while promoting efficient polymer removal and minimizing ozone-induced damage to low-k films.
Implementation Method 1
the substrate is irradiated with ultraviolet rays having a wavelength of 200 nm or less before and/or after the processing liquid supply step, so that the substrate is destaticized
Implementation Method 2
promoting efficient polymer removal
Data Source
AI summary
A substrate processing method according to an embodiment includes a processing liquid supply step and an UV irradiation step. In the processing liquid supply step, a processing liquid is supplied to a substrate. In the UV irradiation step, the substrate after the processing liquid supply step is irradiated with ultraviolet rays having a wavelength of 200 nm or less, so that the substrate after the processing liquid supply step is destaticized.