UV Light Emitting Device Conductive Patterns Heat Dissipation
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Solution Overview
Problem
Deep UV light emitting devices face challenges with heat dissipation and reliability due to high power output and low luminous efficacy, leading to component damage and poor heat dissipation efficiency in existing designs.
Innovation Solution
A high-power UV light emitting device is designed with a first body featuring conductive patterns that occupy at least 80% of the surface area, allowing for effective heat dissipation and improved durability, along with a second body and cover configuration that protects the light emitting elements and eliminates the need for a wiring process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a multi-chip package or COB-type light emitting device is used to compensate for low luminous efficacy, then high optical power is achieved, but heat generation increases significantly
Solution Approach 1:
The device is divided into multiple light emitting chips arranged in series, with each chip mounted on its own heat dissipation structure. The conductive patterns are segmented into multiple regions (first, second, third, fourth pad electrode regions) that can independently conduct heat away from different chips, allowing high total power output while distributing heat generation across multiple localized dissipation paths
Solution Approach 2:
Conductive patterns serve as intermediary heat transfer elements between the light emitting chips and the heat dissipation structure. These patterns include pad electrode regions that make direct contact with the chips and extend to larger heat dissipation areas, acting as thermal conduits that efficiently transfer heat from the high-power chips to the surrounding dissipation structure
2Device complexity
If conventional linear electrode pattern structure is used, then device complexity is reduced, but heat dissipation efficiency deteriorates
Solution Approach 1:
The conductive patterns transition from simple linear electrode traces to two-dimensional expanded pad electrode regions. These patterns include first, second, third, and fourth pad electrode regions that spread out in multiple directions, increasing the heat dissipation surface area without significantly increasing structural complexity. The patterns form a network-like structure that provides multiple heat conduction pathways
Solution Approach 2:
The conductive patterns serve multiple functions simultaneously: they provide electrical connection between light emitting chips, act as heat dissipation pathways, and form structural support elements. The pad electrode regions function both as electrical contacts and as expanded heat transfer surfaces, eliminating the need for separate dedicated heat sink structures
3Power
If UV light emitting device operates at high output power, then optical performance is improved, but reliability of components deteriorates due to component damage from UV light and heat
Solution Approach 1:
The harmful heat generated by high-power UV light emitting chips is converted into a manageable thermal conduction problem. The conductive patterns are designed with pad electrode regions that maximize thermal contact area, transforming the harmful heat accumulation into efficient heat flow through the patterns and into the heat dissipation structure, thereby protecting components from thermal damage
Solution Approach 2:
Heat dissipation pathways are established in advance through the pre-designed conductive patterns with pad electrode regions. Before heat can accumulate and damage components, the thermal conduction paths are already in place, allowing immediate heat transfer from the chips to the dissipation structure as soon as the device operates at high power
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves high heat dissipation efficiency and reliability, enabling high-power output while minimizing component damage and simplifying the manufacturing process.
Implementation Method 1
the area of electrodes connected between light emitting elements is maximized to increase the amount of heat emitted through the electrodes
Data Source
AI summary
A light-emitting device is provided. The light-emitting device comprises: a first body unit including a base part and at least three conductive patterns positioned on the base part while including a plurality of element loading areas; and a plurality of light-emitting elements positioned on the plurality of element loading areas of the first body unit, wherein at least one conductive pattern among the conductive patterns is electrically connected to at least two light-emitting elements, the at least two light-emitting elements are connected to each other in series, at least two conductive patterns among the conductive patterns include pad electrode areas, an area of the plurality of conductive patterns is 80% or more of an upper surface area of the base part, and a separation distance among the plurality of conductive patterns is 200 μm to 2,400 μm.