UV-Heated Adhesive Disassembly Method
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Solution Overview
Problem
Conventional methods for disassembling bonded components using adhesives with high heat, moisture, and light resistance are inefficient, often requiring sacrificial adhesiveness and introducing foaming agents or heat/light-labile functionalities, which compromise performance under high temperature and humidity conditions.
Innovation Solution
A method involving irradiation with light of 280 nm or more and heating to 150° C.-300° C. using acrylic and/or epoxy adhesives, which include (meth)acrylates and polymerization initiators, to effectively disassemble bonded bodies while maintaining superior heat, moisture, and light resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If solvents such as organic solvents, strong acids, or strong alkalis are used for disassembly of adhesives, then disassembly capability is improved, but burden on human body and environment increases due to large amounts of solvent used for long periods of time
Solution Approach 1:
The patent replaces chemical disassembly methods (solvents, acids, alkalis) with a physical method using UV light irradiation. The adhesive contains a photodegradable group that breaks down upon UV exposure, enabling disassembly without harmful chemicals. This substitutes chemical action with photochemical action, eliminating solvent burden while maintaining disassembly capability.
Solution Approach 2:
The patent introduces a photodegradable group into the adhesive molecule that changes its properties under UV light irradiation. The adhesive transitions from a stable bonded state to a decomposed state when exposed to specific wavelengths of UV light, enabling controlled disassembly. This parameter change (molecular decomposition under light) allows disassembly without environmental burden.
2Ease of repair
If foaming agents which foam upon heating or by UV are formulated in adhesives, then disassemblability by heating or UV is improved, but heat resistance and moisture resistance are sacrificed
Solution Approach 1:
The patent extracts the disassemblability function from a separate foaming agent and integrates it directly into the adhesive molecule through a photodegradable group. This eliminates the need for foaming agents that compromise heat and moisture resistance, while achieving the same disassembly effect through UV-induced molecular decomposition.
Solution Approach 2:
The patent creates a composite adhesive structure combining a base adhesive component with a photodegradable group. This composite structure maintains the heat and moisture resistance of the base adhesive while adding UV-responsive disassemblability through the photodegradable component, avoiding the need for sacrificial foaming agents.
3Ease of repair
If adhesives are designed to be easily peeled in water or warm water, then disassemblability is improved, but heat resistance and moisture resistance are reduced because they are easily peeled under high temperature and humidity conditions
Solution Approach 1:
The patent incorporates a photodegradable group into the adhesive that is stable under normal conditions but activates upon UV light irradiation. This preliminary incorporation of the photo-responsive component allows the adhesive to maintain strong bonding and resistance under heat and moisture, while enabling controlled disassembly when UV light is applied.
Solution Approach 2:
The patent replaces thermal or moisture-based disassembly mechanisms with UV light-induced photodegradation. This substitution allows the adhesive to maintain stability under heat and moisture conditions while providing a separate, controlled disassembly pathway through UV irradiation that does not compromise resistance properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy disassembly of bonded bodies with adhesives that retain high heat, moisture, and light resistance, enhancing versatility and reducing the need for foaming agents or heat/light-sensitive components.
Implementation Method 1
irradiating UV light for disassembling or peeling, and adhesives are disclosed
Implementation Method 2
heating the bonded body to 150° C.-300° C.
Data Source
AI summary
Provided is a method for disassembling a bonded body, whereby the bonded body can be easily disassembled and peeled. The method for disassembling a bonded body formed by bonding substrates with an adhesive comprises irradiating light having a wavelength of 280 nm or more such that irradiation energy is 1000-5000000 mJ/cm2 at a wavelength of 365 nm while heating the bonded body to 150° C.-300° C.