UV Laser Hole Processing with Deposited Ablation Products
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Solution Overview
Problem
Existing laser processing methods for semiconductor exposure and material processing face challenges in achieving high resolution and minimizing chromatic aberration due to wide spectral linewidths of excimer laser beams, which can lead to decreased resolution and inefficient processing.
Innovation Solution
A laser processing method that involves depositing a product generated from a first glass substrate onto a second glass substrate using a first ultraviolet pulse laser beam under specific irradiation conditions, and then forming a hole by irradiating the deposited product with a second ultraviolet pulse laser beam under different irradiation conditions, thereby enhancing the contribution of the laser beam from the first pulse and reducing the cumulative number of irradiation pulses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an excimer laser beam with wide spectral linewidth is used for processing, then material processing capability is improved, but chromatic aberration occurs and resolution decreases
Solution Approach 1:
The laser processing is divided into two distinct stages: a first stage using an excimer laser for material ablation and product generation, and a second stage using a different laser for hole formation. This segmentation allows each stage to use laser parameters optimized for its specific function, resolving the contradiction between material processing capability and resolution.
Solution Approach 2:
The first laser processing step performs preliminary action by generating and depositing processing products on the workpiece surface before the second hole formation step. This preliminary deposition modifies the surface properties, enabling the second laser to form holes with higher precision while reducing the cumulative pulse count needed.
2Length of stationary object
If the number of irradiation pulses is increased to form deep holes, then hole depth is improved, but processing efficiency decreases due to cumulative pulse requirements
Solution Approach 1:
The first laser processing step performs preliminary action by generating and depositing processing products that modify the workpiece surface. This preliminary modification reduces the cumulative number of pulses required in the second hole formation step, thereby achieving deep holes while maintaining high processing efficiency.
Solution Approach 2:
The invention changes laser processing parameters by using two different laser types with different characteristics. The first laser operates with parameters optimized for material ablation and product generation, while the second laser uses parameters optimized for precise hole formation. This parameter change enables efficient deep hole formation with reduced cumulative pulse count.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for efficient laser hole processing with reduced cumulative irradiation pulses, improving processing efficiency and maintaining a high aspect ratio of the formed holes, thus addressing the limitations of existing methods.
Implementation Method 1
depositing a product generated from a first glass substrate at a processing position of a second glass substrate by irradiating the first glass substrate with a first ultraviolet pulse laser beam
Implementation Method 2
forming a hole by irradiating the processing position where the product is deposited with a second ultraviolet pulse laser beam
Data Source
AI summary
A laser processing method according to one aspect of the present disclosure includes depositing a product generated from a first glass substrate at a processing position of a second glass substrate by irradiating the first glass substrate with a first ultraviolet pulse laser beam under a first irradiation condition, and forming a hole by irradiating the processing position where the product is deposited with a second ultraviolet pulse laser beam under a second irradiation condition different from the first irradiation condition.