UV LED Cap with AuSn Bonds for Reliable Glass Substrate Joining
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Solution Overview
Problem
Current light emitting devices face challenges in improving reliability and reducing production costs, particularly in the manufacturing of ultraviolet light emitting devices with efficient heat radiation and light transmission performance.
Innovation Solution
The proposed light emitting device includes a mounting substrate with a support, conductors, and bonding metal layers, a cap with a recess and a glass ultraviolet light transmitting part, and uses AuSn bonds for electrical connections, allowing for efficient heat dissipation and light transmission while reducing production costs through a method involving flip-chip bonding and AuSn layer formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a glass cover is used for ultraviolet light transmission, then light output is improved, but bonding reliability deteriorates due to poor adhesion between glass and conventional substrates
Solution Approach 1:
An Au (gold) layer is introduced as an intermediary between the glass cover and the inorganic substrate. This Au layer serves dual purposes: it provides excellent adhesion to the glass cover while also serving as a bonding foundation for the inorganic substrate, thereby resolving the adhesion problem between glass and conventional substrates and enabling reliable bonding while maintaining ultraviolet light transmission
Solution Approach 2:
The invention uses a composite structure consisting of multiple layers including the inorganic substrate, AuSn bonding layer, Au foundation layer, and glass cover. This composite material approach allows each layer to contribute its specific properties: the inorganic substrate provides mechanical support and heat dissipation, the Au layers provide adhesion and electrical conductivity, and the glass cover provides ultraviolet light transmission, collectively achieving both reliable bonding and high light output
2Reliability
If flip-chip bonding with AuSn is used for mounting, then electrical connection and heat dissipation are improved, but manufacturing complexity increases
Solution Approach 1:
The invention merges multiple functions into the AuSn layer: it serves as both the electrical connection medium and the heat dissipation pathway. By combining these functions into a single bonding layer, the manufacturing process achieves reliable electrical and thermal performance without requiring separate additional layers or complex assembly steps, thereby reducing overall manufacturing complexity while improving connection reliability
3Temperature
If multiple bonding layers are used for heat dissipation, then heat radiation performance is improved, but production cost increases
Solution Approach 1:
The invention applies local quality by concentrating heat dissipation functionality in specific regions where it is most needed - at the bonding interfaces between components. The AuSn bonding layers are strategically positioned at critical heat generation points (LED chip to substrate, glass cover to substrate) to provide efficient heat pathways exactly where required, rather than using heat dissipation structures throughout the entire device, thereby achieving effective heat radiation while controlling production costs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability and heat radiation performance of ultraviolet light emitting devices, improves light output, and decreases production costs by using AuSn bonds and a glass cover for efficient light transmission and heat management.
Implementation Method 1
the first electrode and the first conductor are bonded with a first bond made of AuSn, and the second electrode and the second conductor are bonded with a second bond made of AuSn
Implementation Method 2
at least the ultraviolet light transmitting part is made of glass for transmitting ultraviolet light emitted from the ultraviolet light emitting element
Implementation Method 3
the first bonding metal layer and the second bonding metal layer are bonded with a third bond made of AuSn
Data Source
AI summary
The light emitting device includes the cap including the ultraviolet light transmitting part made of glass for transmitting ultraviolet light. In the light emitting device, the first electrode of the ultraviolet light emitting element and the first conductor of the mounting substrate are bonded with the first bond made of AuSn, the second electrode of the ultraviolet light emitting element and the second conductor of the mounting substrate are bonded with the second bond made of AuSn, and the first bonding metal layer of the mounting substrate and the second bonding metal layer of the cap are bonded with the third bond made of AuSn.