UV LED Package Ceramic Body Glass Film Heat Dissipation
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Solution Overview
Problem
UV LEDs generate excessive heat, leading to reliability issues and compromising integration and economic efficiency when attempting to improve heat dissipation, which is not effectively addressed by existing packaging solutions.
Innovation Solution
A light emitting device package featuring a ceramic body with a cavity housing the UV LED, a support member surrounding the cavity, and a glass film covering it, which enhances heat dissipation and maintains a compact size, ensuring compatibility with various UV wavelengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the package size of UV LEDs is increased to improve heat dissipation efficiency, then heat dissipation is improved, but integration efficiency and economic efficiency are jeopardized
Solution Approach 1:
The patent applies local quality by using a ceramic substrate with high heat conductivity specifically in the heat dissipation pathway, while maintaining a compact overall package structure. The ceramic substrate is positioned directly beneath the UV LED chip to locally enhance heat dissipation without increasing the overall package volume.
Solution Approach 2:
The patent employs composite materials by combining ceramic substrate material with high heat conductivity properties with the LED package structure. This composite approach enables effective heat dissipation while maintaining a compact package size, resolving the contradiction between heat dissipation efficiency and package volume.
2Power
If UV LEDs generate a large amount of heat, then light emission function is achieved, but operation reliability is degraded
Solution Approach 1:
The patent converts the harmful heat generated by UV LED operation into a manageable thermal flow by designing a dedicated heat dissipation pathway through the ceramic substrate. The heat, which would otherwise degrade reliability, is channeled efficiently to the substrate, transforming a harmful effect into a controlled thermal management solution.
Solution Approach 2:
The ceramic substrate acts as an intermediary between the UV LED chip and the external environment, mediating heat transfer. It provides a high-conductivity pathway that isolates the LED chip from direct thermal stress while efficiently conducting heat away, thereby protecting reliability while maintaining light emission capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat dissipation in UV LEDs, improving operational reliability and maintaining a compact package size, thus addressing the heat-related issues and integration challenges faced by existing UV LED packages.
Implementation Method 1
a glass film (80) coupled to the support member (95), and covering the cavity (15)
Implementation Method 2
UV LEDs generate a large amount of heat while emitting light, which causes a defect and degrades operation reliability
Data Source
Figure 1~2
Figure 3~4
Figure 5a~6
AI summary
Provided is a light emitting device package, which includes a ceramic body(10), an ultraviolet light emitting diode (20), a support member, and a glass film (80). The ceramic body (10) defines a cavity (15). The ultraviolet light emitting diode (20) is disposed within the cavity (15). The support member (95) is disposed on the body (10), and surrounds the cavity (15). The glass film (80) is coupled to the support member (95), and covers the cavity(15). Since the light emitting device package includes the ceramic body to efficiently dissipate heat, and the glass film is directly attached to the ceramic body to decrease the number of components, thereby simplifying the manufacturing process thereof, and reducing the manufacturing costs thereof.