UV LED Array Conductive Fastener Interconnect Heat Dissipation
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Solution Overview
Problem
Conventional electrical connections in high power device layouts, such as UV LED arrays, face challenges with heat dissipation and reliability due to thermal fatigue, mechanical strain, and high power density, leading to potential failures and inefficiencies in compact designs.
Innovation Solution
A conductive fastener interconnect system using substrates with patterned circuits and a heat sink, where an electrically and thermally conductive liner lines apertures through substrates and heat sinks, allowing for robust, reliable, and efficient heat dissipation while eliminating wire bonds and solder connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wire-based connectors are used for electrical connections in UV LED arrays, then ease of manufacture is improved, but reliability deteriorates due to thermal fatigue and mechanical strain from high power density
Solution Approach 1:
The patent removes wire-based connectors and solder connections from the system, extracting the problematic electrical connection method that caused thermal fatigue and mechanical strain. Instead, it uses direct substrate-based electrical pathways integrated with the heat sink structure, eliminating the vulnerable wire connection components while maintaining electrical functionality.
Solution Approach 2:
The patent merges the electrical connection function with the heat dissipation structure by integrating conductive pathways directly into the heat sink substrate. This combination eliminates separate wire connectors and solder joints, creating a unified structure that simultaneously provides electrical connectivity and thermal management, thereby improving reliability under high power density conditions.
2Ease of operation
If conventional wired connections are used, then ease of operation is improved, but device complexity increases due to additional components and assembly steps
Solution Approach 1:
The patent combines multiple functions into the heat sink substrate: thermal dissipation, electrical conduction, and mechanical support. This integration eliminates the need for separate wire connectors, terminals, and soldering operations, thereby reducing device complexity while maintaining ease of operation through simplified assembly.
Solution Approach 2:
The heat sink substrate is designed to perform multiple functions simultaneously: it dissipates heat, provides electrical pathways for current flow, and serves as a mechanical mounting structure. This multi-functionality reduces the number of discrete components needed, simplifying the overall device structure while maintaining operational ease.
3Ease of manufacture
If organic insulation materials are used in UV LED connections, then ease of manufacture is improved, but reliability deteriorates due to degradation from UV light and heat exposure
Solution Approach 1:
The patent employs inorganic composite materials for the heat sink substrate and insulation structures, combining materials with high thermal conductivity, UV resistance, and thermal stability. These composite materials replace organic insulation that degrades under UV and heat, providing long-term reliability while maintaining manufacturability through established ceramic and metal processing techniques.
Solution Approach 2:
The patent eliminates the use of degradable organic materials that have limited service life under UV exposure. By using durable inorganic materials with extended operational lifetimes, the system avoids frequent replacement or maintenance, improving reliability without significantly increasing manufacturing complexity.
4Temperature
If ceramic substrates are used to reduce thermal effect, then temperature is reduced, but reliability deteriorates due to cracking risks at connector locations
Solution Approach 1:
The patent removes traditional wire connectors and solder joints from the ceramic substrate, extracting the stress concentration points that lead to cracking. By eliminating these external connection components and using integrated substrate-based electrical pathways, the system maintains effective temperature management without creating vulnerability points for thermal stress-induced cracking.
Solution Approach 2:
The patent integrates electrical conduction pathways directly into the ceramic substrate structure, merging the electrical connection function with the thermal management substrate. This integration eliminates separate connector components that create stress concentrations, thereby maintaining low temperature operation while preventing cracking and improving reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances reliability and efficiency by providing effective heat dissipation and mechanical robustness, reducing the risk of failures and extending the service life of high power density devices, suitable for applications beyond UV LED arrays.
Implementation Method 1
an electrically and thermally conductive liner positioned adjacent to the electrical insulator... dissipates heat through the electrically and thermally conductive liner to the at least first heat sink
Implementation Method 2
At least a first heat sink that is configured to dissipate heat from the UV LED array
Data Source
AI summary
A heat sink and power interconnect for a UV LED array are provided. A first circuit is disposed on a surface of a first substrate. A UV LED array is positioned thereon. A second substrate and second circuit are spaced apart from the first substrate and a first heat sink is positioned adjacent thereto. An aperture passes through each of the first substrate, the second substrate, and the heat sink. An electrical insulator lines the aperture with an electrically and thermally conductive liner positioned adjacent to the electrical insulator. A fastener is positioned in the aperture and electrically interconnects the first circuit and the second circuit through the electrically and thermally conductive liner and electrically communicates with an external power supply. The fastener carries one or more of a power or an electrical signal, and dissipates heat through the electrically and thermally conductive liner to the heat sink.